ZHCSFA9A June 2016 – July 2016 DRV2511-Q1
PRODUCTION DATA.
The EVM layout optimizes for thermal dissipation and EMC performance. The DRV2511-Q1 device has a thermal pad down, and good thermal conduction and dissipation require adequate copper area. Layout also affects EMC performance. It is best practice to use the same/similiar layout as shown below in the DRV2511Q1EVM.