ZHCSDG6C March   2015  – January 2023 DRV2700

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Boost Converter and Control Loop
      2. 7.3.2 High-Voltage Amplifier
      3. 7.3.3 Fast Start-Up (Enable Pin)
      4. 7.3.4 Gain Control
      5. 7.3.5 Adjustable Boost Voltage
      6. 7.3.6 Adjustable Boost Current-Limit
      7. 7.3.7 Internal Charge Pump
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Boost + Amplifier Mode
      2. 7.4.2 Flyback Mode
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 AC-Coupled DAC Input Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Piezo Load Selection
          2. 8.2.1.2.2  Programming The Boost Voltage
          3. 8.2.1.2.3  Inductor and Transformer Selection
          4. 8.2.1.2.4  Programing the Boost and Flyback Current-Limit
          5. 8.2.1.2.5  Boost Capacitor Selection
          6. 8.2.1.2.6  Pulldown FET and Resistors
          7. 8.2.1.2.7  Low-Voltage Operation
          8. 8.2.1.2.8  Current Consumption Calculation
          9. 8.2.1.2.9  Input Filter Considerations
          10. 8.2.1.2.10 Output Limiting Factors
          11. 8.2.1.2.11 Startup and Shutdown Sequencing
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Filtered AC Coupled Single-Ended PWM Input Application
      3. 8.2.3 DC-Coupled DAC Input Application
      4. 8.2.4 DC-Coupled Reference Input Application
      5. 8.2.5 Flyback Circuit
    3. 8.3 System Example
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Boost + Amplifier Configuration Layout Considerations
      2. 10.1.2 Flyback Configuration Layout Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGP|20
散热焊盘机械数据 (封装 | 引脚)
订购信息
Output Limiting Factors

Because of the small size of the DRV2700 device, limiting factors must be considered. In each of the applications, four factors can affect the output. These factors include the following:

  • Bandwidth of the amplifier
  • Limited current
  • Slew rate
  • Thermal shutdown

Although some of these factors can appear at the same time, each of these factors are shown in the following figures to help the designer differentiate between each factor.

GUID-EF8E6F43-BF4B-4593-AFBC-5E083D9325F4-low.gifFigure 8-4 Bandwidth and Limited Current

The internal amplifier has an inherent bandwidth limitation on the order of 5 to 20 kHz depending on the gain settings. Although, this bandwidth limitation occurs primarily with a no-load condition or under a very small voltage swing, the output is essentially unable to drive to the expected output voltage because of a drop in the gain at that bandwidth. The internal boost converter can only support a limited amount of current. If for instance, the load was somewhat resistive as opposed to only capacitive, a situation could occur where the load requires additional current to pull the voltage up, however the boost converter cannot support it. This situation appears to be an out-of-regulation output voltage.

GUID-DFC11F05-A6A3-41A6-8552-6D22CF40DBEB-low.gif Figure 8-5 Slew Rate and Thermal Shutdown

As the output frequency increases, the slew rate increases. Because the boost converter can only support a certain amount of current based on the load capacitance, the sine wave begins to turn into more of a triangle wave.

Lastly, the device has a thermal shutdown feature for protection from damaging when the device begins to heat up because of power dissipation. When a load is primarily capacitance, the current leads the voltage (leading power factor). With a leading or lagging power factor, the maximum power does not occur at the maximum voltage or current. However the maximum power does occur at the phase crossing of these. This occurrence looks similar to the waveform in Figure 8-5, such that the output goes to 0 V and then start back up after it has cooled down below the internal threshold. Figure 8-2 shows a general guideline to staying below the maximum voltage and frequency based on the capacitance of the load.