To achieve ideal device performance, use of the thermal footprint outlined by this data sheet is recommended. See the land pattern diagram in the Section 12 section for exact dimensions. The thermal pad of the DRV2700 device must be soldered directly to the thermal pad on the PCB. The thermal pad of the PCB must be connected to the ground net with thermal vias to any existing backside or internal copper ground planes. Connection to a ground plane on the top layer near the corners of the device is also recommended.

Additionally, minimizing the capacitance on the SW node is very important. Minimizing this capacitance is accomplished by placing the transformer very close to the SW pin and by removing the ground plane beneath the transformer pads.