ZHCSDG6C March   2015  – January 2023 DRV2700

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Boost Converter and Control Loop
      2. 7.3.2 High-Voltage Amplifier
      3. 7.3.3 Fast Start-Up (Enable Pin)
      4. 7.3.4 Gain Control
      5. 7.3.5 Adjustable Boost Voltage
      6. 7.3.6 Adjustable Boost Current-Limit
      7. 7.3.7 Internal Charge Pump
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Boost + Amplifier Mode
      2. 7.4.2 Flyback Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 AC-Coupled DAC Input Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Piezo Load Selection
          2. 8.2.1.2.2  Programming The Boost Voltage
          3. 8.2.1.2.3  Inductor and Transformer Selection
          4. 8.2.1.2.4  Programing the Boost and Flyback Current-Limit
          5. 8.2.1.2.5  Boost Capacitor Selection
          6. 8.2.1.2.6  Pulldown FET and Resistors
          7. 8.2.1.2.7  Low-Voltage Operation
          8. 8.2.1.2.8  Current Consumption Calculation
          9. 8.2.1.2.9  Input Filter Considerations
          10. 8.2.1.2.10 Output Limiting Factors
          11. 8.2.1.2.11 Startup and Shutdown Sequencing
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Filtered AC Coupled Single-Ended PWM Input Application
      3. 8.2.3 DC-Coupled DAC Input Application
      4. 8.2.4 DC-Coupled Reference Input Application
      5. 8.2.5 Flyback Circuit
    3. 8.3 System Example
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Boost + Amplifier Configuration Layout Considerations
      2. 10.1.2 Flyback Configuration Layout Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGP|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3.2 High-Voltage Amplifier

When using the high-voltage amplifier in conjunction with the boost converter, the PVDD pin is located next to the BST pin to immediately feed the high voltage signal back into the device to power the amplifier. The DRV2700 device was designed as a differential amplifier. A major benefit of the fully differential amplifier is the improved common-mode rejection ratio (CMRR) over single-ended input amplifiers. The increased CMRR of the differential amplifier reduces sensitivity-to-ground offset that is related noise injection which is important in low-noise systems.

The high-voltage amplifier can be used in a single-ended DC input configuration to provide a DC output on the OUT+ and OUT– pins. The amplifier is very linear across the full voltage range and by using a DAC (digital-to-analog converter) input, the output can be controlled with very good granularity.

Precautions must be taken into thermal concerns of this amplifier because high frequencies, voltage, and capacitive load combinations can overheat the device. See the Section 8.2.1.2.1 section for a general guideline.
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