ZHCSDG6C March   2015  – January 2023 DRV2700

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Boost Converter and Control Loop
      2. 7.3.2 High-Voltage Amplifier
      3. 7.3.3 Fast Start-Up (Enable Pin)
      4. 7.3.4 Gain Control
      5. 7.3.5 Adjustable Boost Voltage
      6. 7.3.6 Adjustable Boost Current-Limit
      7. 7.3.7 Internal Charge Pump
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Boost + Amplifier Mode
      2. 7.4.2 Flyback Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 AC-Coupled DAC Input Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Piezo Load Selection
          2. 8.2.1.2.2  Programming The Boost Voltage
          3. 8.2.1.2.3  Inductor and Transformer Selection
          4. 8.2.1.2.4  Programing the Boost and Flyback Current-Limit
          5. 8.2.1.2.5  Boost Capacitor Selection
          6. 8.2.1.2.6  Pulldown FET and Resistors
          7. 8.2.1.2.7  Low-Voltage Operation
          8. 8.2.1.2.8  Current Consumption Calculation
          9. 8.2.1.2.9  Input Filter Considerations
          10. 8.2.1.2.10 Output Limiting Factors
          11. 8.2.1.2.11 Startup and Shutdown Sequencing
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Filtered AC Coupled Single-Ended PWM Input Application
      3. 8.2.3 DC-Coupled DAC Input Application
      4. 8.2.4 DC-Coupled Reference Input Application
      5. 8.2.5 Flyback Circuit
    3. 8.3 System Example
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Boost + Amplifier Configuration Layout Considerations
      2. 10.1.2 Flyback Configuration Layout Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGP|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1.1 Boost + Amplifier Configuration Layout Considerations

To achieve ideal device performance, use of the thermal footprint outlined by this data sheet is recommended. See the land pattern diagram in the Section 12 section for exact dimensions. The thermal pad of the DRV2700 device must be soldered directly to the thermal pad on the printed circuit board (PCB). The thermal pad of the PCB must be connected to the ground net with thermal vias to any existing backside or internal copper ground planes. Connection to a ground plane on the top layer near the corners of the device is also recommended.

Additionally to help minimize crosstalk between the FB voltage and the SW signal, keep the boost programming resistors (RFB1 and RFB2) as close as possible to the FB pin of the DRV2700 device. Routing this trace underneath the middle of the inductor is also helpful. If possible, provide a grounding plane between the two signals.

Lastly, keep the BST trace and plane as large as possible to help minimize the resistance and inductance.
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