SLDS272 September   2024 DRV81620-Q1

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
      1. 6.5.1 SPI Timing Requirements
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Pins
        1. 7.3.1.1 Input Pins
        2. 7.3.1.2 nSLEEP Pin
      2. 7.3.2 Power Supply
        1. 7.3.2.1 Modes of Operation
          1. 7.3.2.1.1 Power-up
          2. 7.3.2.1.2 Sleep mode
          3. 7.3.2.1.3 Idle mode
          4. 7.3.2.1.4 Active mode
          5. 7.3.2.1.5 Limp Home mode
        2. 7.3.2.2 Reset condition
      3. 7.3.3 Power Stage
        1. 7.3.3.1 Switching Resistive Loads
        2. 7.3.3.2 Inductive Output Clamp
        3. 7.3.3.3 Maximum Load Inductance
        4. 7.3.3.4 Reverse Current Behavior
        5. 7.3.3.5 Switching Channels in parallel
        6. 7.3.3.6 Bulb Inrush Mode (BIM)
        7. 7.3.3.7 Integrated PWM Generator
      4. 7.3.4 Protection and Diagnostics
        1. 7.3.4.1 Undervoltage on VM
        2. 7.3.4.2 Overcurrent Protection
        3. 7.3.4.3 Over Temperature Protection
        4. 7.3.4.4 Over Temperature Warning
        5. 7.3.4.5 Over Temperature and Overcurrent Protection in Limp Home mode
        6. 7.3.4.6 Reverse Polarity Protection
        7. 7.3.4.7 Over Voltage Protection
        8. 7.3.4.8 Output Status Monitor
        9. 7.3.4.9 Open Load Detection in ON State
          1. 7.3.4.9.1 Open Load at ON - direct channel diagnosis
          2. 7.3.4.9.2 Open Load at ON - diagnosis loop
          3. 7.3.4.9.3 OLON bit
      5. 7.3.5 SPI Communication
        1. 7.3.5.1 SPI Signal Description
          1. 7.3.5.1.1 Chip Select (nSCS)
            1. 7.3.5.1.1.1 Logic high to logic low Transition
            2. 7.3.5.1.1.2 Logic low to logic high Transition
          2. 7.3.5.1.2 Serial Clock (SCLK)
          3. 7.3.5.1.3 Serial Input (SDI)
          4. 7.3.5.1.4 Serial Output (SDO)
        2. 7.3.5.2 Daisy Chain Capability
        3. 7.3.5.3 SPI Protocol
        4. 7.3.5.4 SPI Registers
          1. 7.3.5.4.1  Standard Diagnosis Register
          2. 7.3.5.4.2  Output control register
          3. 7.3.5.4.3  Bulb Inrush Mode Register
          4. 7.3.5.4.4  Input 0 Mapping Register
          5. 7.3.5.4.5  Input 1 Mapping Register
          6. 7.3.5.4.6  Input Status Monitor Register
          7. 7.3.5.4.7  Open Load Current Control Register
          8. 7.3.5.4.8  Output Status Monitor Register
          9. 7.3.5.4.9  Open Load at ON Register
          10. 7.3.5.4.10 EN_OLON Register
          11. 7.3.5.4.11 Configuration Register
          12. 7.3.5.4.12 Output Clear Latch Register
          13. 7.3.5.4.13 FPWM Register
          14. 7.3.5.4.14 PWM0 Configuration Register
          15. 7.3.5.4.15 PWM1 Configuration Register
          16. 7.3.5.4.16 PWM_OUT Register
          17. 7.3.5.4.17 MAP_PWM Register
          18. 7.3.5.4.18 Configuration 2 Register
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Suggested External Components
    2. 8.2 Layout
      1. 8.2.1 Layout Guidelines
      2. 8.2.2 Package Footprint Compatibility
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Output Status Monitor

The device compares each channel VDS with VOSM (for auto-configurable channels used in low-side switch configuration), VOUT_S with VOSM (for auto-configurable channels used in high-side switch configuration), VOUT with VOSM (for high-side channels) and sets the corresponding OSMx bits accordingly. The bits are updated every time OSM register is read.

  • VDS < VOSM → OSMx = 1b (low-side switch configuration)

  • VOUT_S > VOSM → OSMx = 1b (auto-configurable channels used as high-side)

A diagnosis current IOL in parallel to the power switch can be enabled by programming the IOLx bit, which can be used for Open Load at OFF detection. Each channel has its dedicated diagnosis current source. If the diagnosis current IOL is enabled or if the channel changes state (ON → OFF or OFF → ON) it is necessary to wait a time tOSM for a reliable diagnosis. Enabling IOL current sources increases the current consumption of the device. Even if an Open Load is detected, the channel is not latched OFF.

See Figure 7-16 for a timing overview (the values of IOLx refer to a channel in normal operation properly connected to the load).

DRV81620-Q1 Output Status Monitor
                    timing Figure 7-16 Output Status Monitor timing

Output Status Monitor diagnostic is available when VM = VM_NOR and VDD ≥ VDD_UVLO.

Due to the fact that Output Status Monitor checks the voltage level at the outputs in real time, for Open Load in OFF diagnostic it is necessary to synchronize the reading of OSM register with the OFF state of the channels.

The following figures show how Output Status Monitor is implemented at concept level.

DRV81620-Q1 Output
                    Status Monitor - Auto-configurable Channel as High-side Figure 7-17 Output Status Monitor - Auto-configurable Channel as High-side
DRV81620-Q1 Output
                    Status Monitor - Auto-configurable Channel as Low-side Figure 7-18 Output Status Monitor - Auto-configurable Channel as Low-side
DRV81620-Q1 Output
                    Status Monitor - High-side Channels Figure 7-19 Output Status Monitor - High-side Channels

In Standard Diagnosis the bit OLOFF represents the OR combination of all OSMx bits for all channels in OFF state which have the corresponding current source IOL activated.

When the DISOL bit is 1b, open load detection is disabled by disabling all the IOL current sources.