10.1 Layout Guidelines

Use these layout recommendations when designing a PCB for the DRV8302.

• The DRV8302 makes an electrical connection to GND through the PowerPAD. Always check to ensure that the PowerPAD has been properly soldered (See the application report, PowerPAD™ Thermally Enhanced Package application report, SLMA002).
• PVDD bypass capacitors should be placed close to their corresponding pins with a low impedance path to device GND (PowerPAD).
• GVDD bypass capacitor should be placed close its corresponding pin with a low impedance path to device GND (PowerPAD).
• AVDD and DVDD bypass capacitors should be placed close to their corresponding pins with a low impedance path to the AGND pin. It is preferable to make this connection on the same layer.
• AGND should be tied to device GND (PowerPAD) through a low impedance trace/copper fill.
• Add stitching vias to reduce the impedance of the GND path from the top to bottom side.
• Try to clear the space around and underneath the DRV8302 to allow for better heat spreading from the PowerPAD.

10.2 Layout Example

Figure 12. Top and Bottom Layer Layout Schematic