ZHCSC39B February   2014  – November 2017 DRV8308

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Hall Comparators
      2. 7.3.2  FG Amplifier, Comparator, and FG Output
      3. 7.3.3  Enable, Reset, and Clock Generation
      4. 7.3.4  Commutation
        1. 7.3.4.1 120° 3-Hall Commutation
        2. 7.3.4.2 120° Single-Hall Commutation
        3. 7.3.4.3 180° Sine-Wave-Drive Commutation
      5. 7.3.5  Commutation Logic Block Diagram
      6. 7.3.6  Commutation Parameters
      7. 7.3.7  Braking
      8. 7.3.8  Output Pre-Drivers
      9. 7.3.9  Current Limit
      10. 7.3.10 Charge Pump
      11. 7.3.11 5-V Linear Regulator
      12. 7.3.12 Power Switch
      13. 7.3.13 Protection Circuits
        1. 7.3.13.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.13.2 VM Overvoltage (VMOV)
        3. 7.3.13.3 Motor Overcurrent (OCP)
        4. 7.3.13.4 Charge Pump Failure (CPFAIL)
        5. 7.3.13.5 Charge Pump Short (CPSC)
        6. 7.3.13.6 Overtemperature (OTS)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Speed Input
        1. 7.4.1.1 Clock Frequency Mode
        2. 7.4.1.2 Clock PWM and Internal Register PWM Modes
      2. 7.4.2 Auto Gain and Advance Compensation
      3. 7.4.3 External EEPROM Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Serial Data Format
      3. 7.5.3 Programming the OTP Configuration Memory
    6. 7.6 Register Map
      1. 7.6.1 Control Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Internal Speed Control Loop Constraints
      2. 8.1.2 Hall Sensor Configurations and Connections
      3. 8.1.3 FG Amplifier Configurations and Connections
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Motor voltage
        2. 8.2.2.2 Motor Current (Peak and RMS)
        3. 8.2.2.3 Speed Command Method
        4. 8.2.2.4 Required Flutter (Speed Jitter)
        5. 8.2.2.5 Configuration Method
        6. 8.2.2.6 Hall Element Current
        7. 8.2.2.7 Power FET Switching Time
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
      1. 8.3.1 RESET and ENABLE Considerations
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from A Revision (October 2014) to B Revision

  • Deleted 从特性 部分中删除了锁定转子检测和重启Go
  • Deleted 从说明中删除了锁定转子检测Go
  • Deleted Rotor Stall Detection from FAULTn description in the Pin FunctionsGo
  • Deleted extra notes in the Thermal Information table (refer to the Semiconductor and IC Package Thermal Metrics application report for this informationGo
  • Deleted RLOCK from tRETRY in the Electrical CharacteristicsGo
  • Deleted tLOCK from the Electrical CharacteristicsGo
  • Deleted Locked Rotor Detection from OverviewGo
  • Updated direction change behavior in the Commutation sectionGo
  • Deleted the Rotor Lockup (RLOCK) section in theProtectton Circuits sectionGo
  • Changed the LRTIME bit to reserved in the Register Description tableGo
  • Changed the RLOCK bit to reserved in the Register Description tableGo
  • Added 接收文档更新通知 和社区资源 部分Go

Changes from * Revision (February 2014) to A Revision

  • Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
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