ZHCSP68C
December 2021 – October 2022
DRV8328
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specification
7.1
Absolute Maximum Ratings
7.2
ESD Ratings Comm
7.3
Recommended Operating Conditions
7.4
Thermal Information 1pkg
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Three BLDC Gate Drivers
8.3.1.1
PWM Control Modes
8.3.1.1.1
6x PWM Mode
8.3.1.1.2
3x PWM Mode
8.3.1.2
Device Hardware Interface
8.3.1.3
Gate Drive Architecture
8.3.1.3.1
Propagation Delay
8.3.1.3.2
Deadtime and Cross-Conduction Prevention
8.3.2
AVDD Linear Voltage Regulator
8.3.3
Pin Diagrams
8.3.4
Gate Driver Shutdown Sequence (DRVOFF)
8.3.5
Gate Driver Protective Circuits
8.3.5.1
PVDD Supply Undervoltage Lockout (PVDD_UV)
8.3.5.2
AVDD Power on Reset (AVDD_POR)
8.3.5.3
GVDD Undervoltage Lockout (GVDD_UV)
8.3.5.4
BST Undervoltage Lockout (BST_UV)
8.3.5.5
MOSFET VDS Overcurrent Protection (VDS_OCP)
8.3.5.6
VSENSE Overcurrent Protection (SEN_OCP)
8.3.5.7
Thermal Shutdown (OTSD)
8.4
Device Functional Modes
8.4.1
Gate Driver Functional Modes
8.4.1.1
Sleep Mode
8.4.1.2
Operating Mode
8.4.1.3
Fault Reset (nSLEEP Reset Pulse)
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Three Phase Brushless-DC Motor Control
9.2.1.1
Detailed Design Procedure
9.2.1.1.1
Motor Voltage
9.2.1.1.2
Bootstrap Capacitor and GVDD Capacitor Selection
9.2.1.1.3
Gate Drive Current
9.2.1.1.4
Gate Resistor Selection
9.2.1.1.5
System Considerations in High Power Designs
9.2.1.1.5.1
Capacitor Voltage Ratings
9.2.1.1.5.2
External Power Stage Components
9.2.1.1.5.3
Parallel MOSFET Configuration
9.2.1.1.6
Dead Time Resistor Selection
9.2.1.1.7
VDSLVL Selection
9.2.1.1.8
AVDD Power Losses
9.2.1.1.9
Power Dissipation and Junction Temperature Losses
9.2.2
Application Curves
10
Power Supply Recommendations
10.1
Bulk Capacitance Sizing
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
11.3
Thermal Considerations
11.3.1
Power Dissipation
12
Device and Documentation Support
12.1
Device Support
12.1.1
Device Nomenclature
12.2
Documentation Support
12.2.1
Related Documentation
12.3
Related Links
12.4
Receiving Notification of Documentation Updates
12.5
Community Resources
12.6
Trademarks
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RUY|28
MPQF229D
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsp68c_oa
zhcsp68c_pm
12.1
Device Support
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