ZHCSQQ0A June   2022  – October 2022 DRV8329

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specification
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings Comm
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information 1pkg
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Three BLDC Gate Drivers
        1. 8.3.1.1 PWM Control Modes
          1. 8.3.1.1.1 6x PWM Mode
          2. 8.3.1.1.2 3x PWM Mode
        2. 8.3.1.2 Device Hardware Interface
        3. 8.3.1.3 Gate Drive Architecture
          1. 8.3.1.3.1 Propagation Delay
          2. 8.3.1.3.2 Deadtime and Cross-Conduction Prevention
      2. 8.3.2 AVDD Linear Voltage Regulator
      3. 8.3.3 Pin Diagrams
      4. 8.3.4 Low-Side Current Sense Amplifiers
        1. 8.3.4.1 Current Sense Operation
      5. 8.3.5 Gate Driver Shutdown Sequence (DRVOFF)
      6. 8.3.6 Gate Driver Protective Circuits
        1. 8.3.6.1 PVDD Supply Undervoltage Lockout (PVDD_UV)
        2. 8.3.6.2 AVDD Power on Reset (AVDD_POR)
        3. 8.3.6.3 GVDD Undervoltage Lockout (GVDD_UV)
        4. 8.3.6.4 BST Undervoltage Lockout (BST_UV)
        5. 8.3.6.5 MOSFET VDS Overcurrent Protection (VDS_OCP)
        6. 8.3.6.6 VSENSE Overcurrent Protection (SEN_OCP)
        7. 8.3.6.7 Thermal Shutdown (OTSD)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Gate Driver Functional Modes
        1. 8.4.1.1 Sleep Mode
        2. 8.4.1.2 Operating Mode
        3. 8.4.1.3 Fault Reset (nSLEEP Reset Pulse)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Three Phase Brushless-DC Motor Control
        1. 9.2.1.1 Detailed Design Procedure
          1. 9.2.1.1.1  Motor Voltage
          2. 9.2.1.1.2  Bootstrap Capacitor and GVDD Capacitor Selection
          3. 9.2.1.1.3  Gate Drive Current
          4. 9.2.1.1.4  Gate Resistor Selection
          5. 9.2.1.1.5  System Considerations in High Power Designs
            1. 9.2.1.1.5.1 Capacitor Voltage Ratings
            2. 9.2.1.1.5.2 External Power Stage Components
            3. 9.2.1.1.5.3 Parallel MOSFET Configuration
          6. 9.2.1.1.6  Dead Time Resistor Selection
          7. 9.2.1.1.7  VDSLVL Selection
          8. 9.2.1.1.8  AVDD Power Losses
          9. 9.2.1.1.9  Current Sensing and Output Filtering
          10. 9.2.1.1.10 Power Dissipation and Junction Temperature Losses
      2. 9.2.2 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance Sizing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
      1. 11.3.1 Power Dissipation
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.3.3 Pin Diagrams

Figure 8-6 shows the input structure for the logic level pins, INHx and INLx. The input can be driven with a voltage or external resistor.

Figure 8-6 Logic-Level Input Pin Structure

Figure 8-7 shows the structure of the four level input pins, MODE and CSAGAIN, on hardware interface devices. The input can be set with an external resistor.

Figure 8-7 Four Level Input Pin Structure

Figure 8-8 shows the structure of the open-drain output pin, nFAULT. The open-drain output requires an external pullup resistor to function correctly.

Figure 8-8 Open-Drain Output Pin Structure
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