If the die temperature exceeds the trip point of the thermal shutdown limit (T_OTSD), all the external MOSFETs are disabled, the charge pump is shut down, and the nFAULT pin is driven low. In addition, the FAULT and TSD bits are latched high. Normal operation continues (gate driver operation and the nFAULT pin is released) when the overtemperature condition is removed. The TSD bit stays latched high indicating that a thermal event occurred until a clear fault command is issued either through the CLR_FLT bit or an ENABLE reset pulse (t_RST). This protection feature cannot be disabled.