SLOSEC6 August   2024 DRV8434A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1. 4.1 Pin Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 STEP and DIR Timing Requirements
      1. 5.6.1 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Stepper Motor Driver Current Ratings
        1. 6.3.1.1 Peak Current Rating
        2. 6.3.1.2 RMS Current Rating
        3. 6.3.1.3 Full-Scale Current Rating
      2. 6.3.2 PWM Motor Drivers
      3. 6.3.3 Microstepping Indexer
      4. 6.3.4 Controlling VREF with an MCU DAC
      5. 6.3.5 Current Regulation and Decay Mode
        1. 6.3.5.1 Smart tune Ripple Control
        2. 6.3.5.2 Blanking time
      6. 6.3.6 Charge Pump
      7. 6.3.7 Linear Voltage Regulators
      8. 6.3.8 Logic Level, Tri-Level and Quad-Level Pin Diagrams
        1. 6.3.8.1 nFAULT and STL_REP Pin
      9. 6.3.9 Protection Circuits
        1. 6.3.9.1 VM Undervoltage Lockout (UVLO)
        2. 6.3.9.2 VCP Undervoltage Lockout (CPUV)
        3. 6.3.9.3 Overcurrent Protection (OCP)
        4. 6.3.9.4 Stall Detection
        5. 6.3.9.5 Open-Load Detection (OL)
        6. 6.3.9.6 Thermal Shutdown (OTSD)
        7.       Fault Condition Summary
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode (nSLEEP = 0)
      2.      43
      3. 6.4.2 Disable Mode (nSLEEP = 1, ENABLE = 0)
      4. 6.4.3 Operating Mode (nSLEEP = 1, ENABLE = Hi-Z/1)
      5. 6.4.4 nSLEEP Reset Pulse
      6.      Functional Modes Summary
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Stepper Motor Speed
        2. 7.2.2.2 Current Regulation
        3. 7.2.2.3 Decay Mode
        4. 7.2.2.4 Application Curves
        5. 7.2.2.5 Thermal Application
          1. 7.2.2.5.1 Power Dissipation
          2. 7.2.2.5.2 Conduction Loss
          3. 7.2.2.5.3 Switching Loss
          4. 7.2.2.5.4 Power Dissipation Due to Quiescent Current
          5. 7.2.2.5.5 Total Power Dissipation
          6. 7.2.2.5.6 Device Junction Temperature Estimation
  9. 8 Power Supply Recommendations
    1. 8.1 Bulk Capacitance
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息
7.2.2.5.4 Power Dissipation Due to Quiescent Current

The power dissipation due to the quiescent current consumed by the power supply is calculated as shown below -

Equation 9. PQ = VVM x IVM

Substituting the values, quiescent power loss can be calculated as shown below -

Equation 10. PQ = 24-V x 5-mA = 0.12-W
Note:

The quiescent power loss is calculated using the typical operating supply current (IVM) which is dependent on supply-voltage, temperature and device to device variation.
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