ZHCS389C June   2011  – December 2022 DRV8662

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fast Start-up (Enable Pin)
      2. 7.3.2 Gain Control
      3. 7.3.3 Adjustable Boost Voltage
      4. 7.3.4 Adjustable Boost Current Limit
      5. 7.3.5 Internal Charge Pump
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Startup/shutdown Sequencing
        1. 7.4.1.1 PWM Source
        2. 7.4.1.2 DAC Source
      2. 7.4.2 Low-voltage Operation
    5. 7.5 Programming
      1. 7.5.1 Programming the Boost Voltage
      2. 7.5.2 Programing the Boost Current Limit
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DRV8662 System Diagram with DAC Input
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Inductor Selection
          2. 8.2.1.2.2 Piezo Actuator Selection
          3. 8.2.1.2.3 Boost Capacitor Selection
          4. 8.2.1.2.4 Current Consumption Calculation
          5. 8.2.1.2.5 Input Filter Considerations
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DRV8662 System Diagram with Filtered Single-Ended PWM Input
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Input Filter Design
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision B (July 2014) to Revision C (December 2022)

  • Changed VDD MIN spec from 3.0 to 3.3Go

Changes from Revision A (November 2012) to Revision B (July 2014)

  • 添加了“器件信息”和“ESD 等级”表、“特性说明”部分、“器件功能模式”、“应用和实施”部分、“电源相关建议”部分、“布局”部分、“器件和文档支持”部分以及“机械、封装和可订购信息”部分Go
  • Added the Thermal Information table after the Recommend Operating Conditions table. Go

Changes from Revision * (June 2011) to Revision A (November 2012)

  • Changed VBST MIN spec from 25 to 15Go
  • Added CL, VIL, VIH specs to Recommended Operating Conditions table.Go
  • Added amplifier bandwidth spec (BW) to the Electrical Characteristics table for each gain settingGo
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