To achieve optimum device performance, use of the thermal footprint outlined by this datasheet is recommended. See land pattern diagram for exact dimensions. The DRV8662 power pad must be soldered directly to the thermal pad on the printed circuit board. The printed circuit board thermal pad should be connected to the ground net with thermal vias to any existing backside/internal copper ground planes. Connection to a ground plane on the top layer near the corners of the device is also recommended.
Another key layout consideration is to keep the boost programming resistors (R1 and R2) as close as possible to the FB pin of the DRV8662. Care should be taken to avoid getting the FB trace near the SW trace.