ZHCSEB6 October   2015 DRV8704

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PWM Motor Drivers
      2. 7.3.2  Direct PWM Input Mode (Dual Brushed DC Gate Driver)
      3. 7.3.3  Current Regulation
      4. 7.3.4  Decay Modes
      5. 7.3.5  Blanking Time
      6. 7.3.6  Gate Drivers
      7. 7.3.7  Configuring Gate Drivers
      8. 7.3.8  External FET Selection
      9. 7.3.9  Protection Circuits
        1. 7.3.9.1 Overcurrent Protection (OCP)
        2. 7.3.9.2 Gate Driver Fault (PDF)
        3. 7.3.9.3 Thermal Shutdown (TSD)
        4. 7.3.9.4 Undervoltage Lockout (UVLO)
      10. 7.3.10 Serial Data Format
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
      1. 7.5.1 Control Registers
        1. 7.5.1.1 CTRL Register (Address = 0x00h)
        2. 7.5.1.2 TORQUE Register (Address = 0x01h)
        3. 7.5.1.3 OFF Register (Address = 0x02h)
        4. 7.5.1.4 BLANK Register (Address = 0x03h)
        5. 7.5.1.5 DECAY Register (Address = 0x04h)
        6. 7.5.1.6 Reserved Register Address = 0x05h
        7. 7.5.1.7 DRIVE Register Address = 0x06h
        8. 7.5.1.8 STATUS Register (Address = 0x07h)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External FET Selection
        2. 8.2.2.2 IDRIVE Configuration
        3. 8.2.2.3 Current Chopping Configuration
        4. 8.2.2.4 Decay Modes
        5. 8.2.2.5 Sense Resistor
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 社区资源
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.2 商标

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.3 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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