ZHCSQ96 July   2021 DRV8770

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings Comm
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Gate Drivers
        1. 7.3.1.1 Gate Drive Timings
          1. 7.3.1.1.1 Propagation Delay
          2. 7.3.1.1.2 Deadtime and Cross-Conduction Prevention
        2. 7.3.1.2 Mode (Inverting and non-inverting INLx)
      2. 7.3.2 Pin Diagrams
      3. 7.3.3 Gate Driver Protective Circuits
        1. 7.3.3.1 VBSTx Undervoltage Lockout (BSTUV)
        2. 7.3.3.2 GVDD Undervoltage Lockout (GVDDUV)
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Bulk Capacitance Sizing
  10. 10Layout
    1. 10.1 Layout Example
    2. 10.2 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGE|24
散热焊盘机械数据 (封装 | 引脚)
订购信息

Detailed Design Procedure

Bootstrap Capacitor and GVDD Capacitor Selection

The bootstrap capacitor must be sized to maintain the bootstrap voltage above the undervoltage lockout for normal operation. Equation 2 calculates the maximum allowable voltage drop across the bootstrap capacitor:

Equation 2. GUID-20200927-CA0I-XQLZ-MPTJ-QHB8BMDQLKGS-low.gif

= 12 V – 0.85 V – 4.5 V = 6.65 V

where

  • VGVDD is the supply voltage of the gate drive
  • VBOOTD is the forward voltage drop of the bootstrap diode
  • VBSTUV is the threshold of the bootstrap undervoltage lockout

In this example the allowed voltage drop across bootstrap capacitor is 6.65 V. It is generally recommended that ripple voltage on both the bootstrap capacitor and GVDD capacitor should be minimized as much as possible. Many of commercial, industrial, and automotive applications use ripple value between 0.5 V to 1 V.

The total charge needed per switching cycle can be estimated with Equation 3:

Equation 3. GUID-20200927-CA0I-DDZV-Q4FH-QZK1NLVQ8GDM-low.gif

= 48 nC + 220 μA/20 kHz = 50 nC + 11 nC = 59 nC

where

  • QG is the total MOSFET gate charge
  • ILBS_TRAN is the bootstrap pin leakage current
  • fSW is the is the PWM frequency

The minimum bootstrap capacitor an then be estimated as below assuming 1-V ΔVBSTx:

Equation 4. GUID-20200927-CA0I-34PB-JZQV-BTKNMXGBXPBL-low.gif

= 59 nC / 1 V = 59 nF

The calculated value of minimum bootstrap capacitor is 59 nF. It should be noted that, this value of capacitance is needed at full bias voltage. In practice, the value of the bootstrap capacitor must be greater than calculated value to allow for situations where the power stage may skip pulse due to various transient conditions. It is recommended to use a 100 nF bootstrap capacitor in this example. It is also recommended to include enough margin and place the bootstrap capacitor as close to the BSTx and SHx pins as possible.

Note: If the bootstrap capacitor value (CBSTx) is above 1 μF, then current flowing through internal bootstrap diode needs to be limited.
The local GVDD bypass capacitor must be greater than the value of bootstrap capacitor value (generally 10 times the bootstrap capacitor value).
Equation 5. GUID-20201221-CA0I-JW7J-DPTD-GFN8RP35WWVZ-low.gif

= 10*100 nF = 1 μF

For this example application, choose 1-µF CGVDD capacitor. Choose a capacitor with a voltage rating at least twice the maximum voltage that it will be exposed to because most ceramic capacitors lose significant capacitance when biased. This value also improves the long term reliability of the system.

Gate Resistance Selection

The slew rate of the SHx connection will be dependent on the rate at which the gate of the external MOSFETs is controlled. The pull-up/pull-down strength of the DRV8770 is fixed internally, hence slew rate of gate voltage can be controlled with an external series gate resistor. In some applications the gate charge, which is load on gate driver device, is significantly larger than gate driver peak output current capability. In such applications external gate resistors can limit the peak output current of the gate driver. External gate resistors are also used to damp ringing and noise.

The specific parameters of the MOSFET, system voltage, and board parasitics will all affect the final slew rate, so generally selecting an optimal value or configuration of external gate resistor is an iterative process.