SLVSA72E April   2010  – October 2015 DRV8813

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Motor Drivers
      2. 7.3.2 Protection Circuits
        1. 7.3.2.1 Overcurrent Protection (OCP)
        2. 7.3.2.2 Thermal Shutdown (TSD)
        3. 7.3.2.3 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Bridge Control
      2. 7.4.2 Current Regulation
      3. 7.4.3 Decay Mode
      4. 7.4.4 Blanking Time
      5. 7.4.5 nRESET and nSLEEP Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Current Regulation
        2. 8.2.2.2 Decay Modes
        3. 8.2.2.3 Sense Resistor
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Bulk Capacitance
    2. 9.2 Power Supply and Logic Sequencing
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Thermal Protection
      2. 10.3.2 Heatsinking
    4. 10.4 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

PWP Package
28-Pin HTSSOP
Top View
DRV8813 po_lvs997.png

Pin Functions

PIN I/O(1) DESCRIPTION EXTERNAL COMPONENTS OR CONNECTIONS
NAME NO.
POWER AND GROUND
CP1 1 IO Charge pump flying capacitor Connect a 0.01-μF, 50-V capacitor between CP1 and CP2.
CP2 2 IO Charge pump flying capacitor
GND 14, 28 Device ground
VCP 3 IO High-side gate drive voltage Connect a 0.1-μF, 16-V ceramic capacitor and a 1-MΩ resistor to VM.
VMA 4 Bridge A power supply Connect to motor supply (8.2 V to 45 V). Both pins must be connected to the same supply, bypassed with a 0.1 uF capacitor to GND, and connected to appropriate bulk capacitance.
VMB 11 Bridge B power supply
V3P3OUT 15 O 3.3-V regulator output Bypass to GND with a 0.47-μF 6.3-V ceramic capacitor. Can be used to supply VREF.
CONTROL
AENBL 21 I Bridge A enable Logic high to enable bridge A. Internal pulldown.
APHASE 20 I Bridge A phase (direction) Logic high sets AOUT1 high, AOUT2 low. Internal pulldown.
AI0 24 I Bridge A current set Sets bridge A current: 00 = 100%,
01 = 71%, 10 = 38%, 11 = 0
Internal pulldown.
AI1 25 I
AVREF 12 I Bridge A current set reference input Reference voltage for winding current set. Can be driven individually with an external DAC for microstepping, or tied to a reference (for example, V3P3OUT).
BENBL 22 I Bridge B enable Logic high to enable bridge B. Internal pulldown.
BI0 26 I Bridge B current set Sets bridge B current: 00 = 100%,
01 = 71%, 10 = 38%, 11 = 0
Internal pulldown.
BI1 27 I
BPHASE 23 I Bridge B phase (direction) Logic high sets BOUT1 high, BOUT2 low. Internal pulldown.
BVREF 13 I Bridge B current set reference input Reference voltage for winding current set. Can be driven individually with an external DAC for microstepping, or tied to a reference (for example, V3P3OUT).
DECAY 19 I Decay mode Low = slow decay, open = mixed decay,
high = fast decay. Internal pulldown and pullup.
nRESET 16 I Reset input Active-low reset input initializes internal logic and disables the H-bridge outputs. Internal pulldown.
nSLEEP 17 I Sleep mode input Logic high to enable device, logic low to enter low-power sleep mode. Internal pulldown.
STATUS
nFAULT 18 OD Fault Logic low when in fault condition (overtemperature, overcurrent)
OUTPUT
AOUT1 5 O Bridge A output 1 Connect to motor winding A
AOUT2 7 O Bridge A output 2
BOUT1 10 O Bridge B output 1 Connect to motor winding B
BOUT2 8 O Bridge B output 2
ISENA 6 IO Bridge A ground / Isense Connect to current sense resistor for bridge A
ISENB 9 IO Bridge B ground / Isense Connect to current sense resistor for bridge B
(1) Directions: I = input, O = output, OZ = tri-state output, OD = open-drain output, IO = input/output