ZHCSQT3K October   2009  – January 2022 DRV8824

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Motor Drivers
      2. 7.3.2 Current Regulation
      3. 7.3.3 Decay Mode
      4. 7.3.4 Blanking Time
      5. 7.3.5 Microstepping Indexer
      6. 7.3.6 nRESET, nENBL and nSLEEP Operation
      7. 7.3.7 Protection Circuits
        1. 7.3.7.1 Overcurrent Protection (OCP)
        2. 7.3.7.2 Thermal Shutdown (TSD)
        3. 7.3.7.3 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 STEP/DIR Interface
      2. 7.4.2 Microstepping
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
      3. 8.2.3 Application Curves
        1.       Power Supply Recommendations
          1. 9.1 Bulk Capacitance
          2. 9.2 Power Supply and Logic Sequencing
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
    4. 9.4 Power Dissipation
    5. 9.5 Heatsinking
  10. 10Device and Documentation Support
    1. 10.1 Community Resources
    2. 10.2 Trademarks
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RHD|28
  • PWP|28
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.3 Thermal Considerations

The DRV8824 has TSD, as described in Section 7.3.7.2. If the die temperature exceeds approximately 150°C, the device is disabled until the temperature drops to a safe level.

Any tendency of the device to enter TSD is an indication of either excessive power dissipation, insufficient heatsinking, or too high an ambient temperature.
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