SLVSB19D February   2012  – March 2015 DRV8834

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Current Control
      2. 8.3.2 Current Recirculation and Decay Modes
      3. 8.3.3 Protection Circuits
        1. 8.3.3.1 Overcurrent Protection (OCP)
        2. 8.3.3.2 Thermal Shutdown (TSD)
        3. 8.3.3.3 Undervoltage Lockout (UVLO)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Phase/Enable Mode
      2. 8.4.2 Indexer Mode
      3. 8.4.3 nSLEEP Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Sense Resistor
    2. 9.2 Typical Application
      1. 9.2.1 Phase/Enable Mode Driving Two DC Motors
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Motor Voltage
          2. 9.2.1.2.2 Power Dissipation
          3. 9.2.1.2.3 Motor Current Trip Point
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Phase/Enable Mode Driving a Stepper Motor
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Stepper Motor Speed
          2. 9.2.2.2.2 Current Regulation
          3. 9.2.2.2.3 Decay Modes
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Indexer Mode Driving a Stepper Motor
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedures
          1. 9.2.3.2.1 Stepper Motor Speed
          2. 9.2.3.2.2 Current Regulation
          3. 9.2.3.2.3 Decay Modes
        3. 9.2.3.3 Application Curves
      4. 9.2.4 High-Resolution Microstepping Using a Microcontroller to Modulate VREF Signals
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
      1. 11.3.1 Maximum Output Current
      2. 11.3.2 Thermal Protection
      3. 11.3.3 Power Dissipation
      4. 11.3.4 Heatsinking
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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