SLVSB19D February   2012  – March 2015 DRV8834

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Current Control
      2. 8.3.2 Current Recirculation and Decay Modes
      3. 8.3.3 Protection Circuits
        1. 8.3.3.1 Overcurrent Protection (OCP)
        2. 8.3.3.2 Thermal Shutdown (TSD)
        3. 8.3.3.3 Undervoltage Lockout (UVLO)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Phase/Enable Mode
      2. 8.4.2 Indexer Mode
      3. 8.4.3 nSLEEP Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Sense Resistor
    2. 9.2 Typical Application
      1. 9.2.1 Phase/Enable Mode Driving Two DC Motors
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Motor Voltage
          2. 9.2.1.2.2 Power Dissipation
          3. 9.2.1.2.3 Motor Current Trip Point
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Phase/Enable Mode Driving a Stepper Motor
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Stepper Motor Speed
          2. 9.2.2.2.2 Current Regulation
          3. 9.2.2.2.3 Decay Modes
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Indexer Mode Driving a Stepper Motor
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedures
          1. 9.2.3.2.1 Stepper Motor Speed
          2. 9.2.3.2.2 Current Regulation
          3. 9.2.3.2.3 Decay Modes
        3. 9.2.3.3 Application Curves
      4. 9.2.4 High-Resolution Microstepping Using a Microcontroller to Modulate VREF Signals
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
      1. 11.3.1 Maximum Output Current
      2. 11.3.2 Thermal Protection
      3. 11.3.3 Power Dissipation
      4. 11.3.4 Heatsinking
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VM Power supply voltage –0.3 11.8 V
AVREF,
BVREF,
VINT,
ADECAY,
BDECAY		 Analog input pin voltage –0.5 3.6 V
Digital input pin voltage –0.5 7 V
xISEN pin voltage –0.3 0.5 V
Peak motor drive output current, t < 1 µs Internally limited A
TJ Operating virtual junction temperature –40 150 °C
Tstg Storage temperature –60 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±4000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

TA = 25°C, over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VM Motor power supply voltage range(1) 2.5 10.8 V
VREF VREF input voltage range(2) 1 2.1 V
IVINT VINT external load current 1 mA
IVREF VREF external load current 400 µA
VDIGIN Digital input pin voltage range –0.3 5.75 V
IOUT Continuous RMS or DC output current per bridge(3) 1.5 A
(1) RDS(ON) increases and maximum output current is reduced at VM supply voltages below 5 V.
(2) Operational at VREF between 0 V and 1 V, but accuracy is degraded.
(3) Power dissipation and thermal limits must be observed.

7.4 Thermal Information

THERMAL METRIC(1) DRV8834 UNIT
PWP [HTSSOP] RGE [VQFN]
24 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance 40.2 35.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 23.7 36.6
RθJB Junction-to-board thermal resistance 21.9 12.2
ψJT Junction-to-top characterization parameter 0.7 0.6
ψJB Junction-to-board characterization parameter 21.7 12.2
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.9 4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

TA = 25°C, over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY
IVM VM operating supply current VM = 5 V, excluding winding current 2.4 4 mA
VM = 10 V, excluding winding current 2.75
IVMQ VM sleep mode supply current VM = 5 V 0.6 2 μA
VM = 10 V 9.6
VUVLO VM undervoltage lockout voltage VM falling 2.39 V
INTERNAL REGULATORS
VINT VINT voltage VM > 3.3 V, IOUT = 0 A to 1 mA 2.85 3 3.15 V
VREFO VREF voltage IOUT = 0 A to 400 µA 1.9 2 2.1 V
LOGIC-LEVEL INPUTS
VIL Input low voltage nSLEEP 0.5 V
All other digital input pins 0.7
VIH Input high voltage nSLEEP 2.5 V
All other digital input pins 2
VHYS Input hysteresis nSLEEP 0.2 V
All except nSLEEP 0.4
RPD Input pulldown resistance nSLEEP 500 kΩ
All except nSLEEP, M0 200
IIL Input low current VIN = 0 1 μA
IIN Input current (M0) -20 20 µA
IIH Input high current VIN = 3.3 V, nSLEEP 6.6 13 μA
VIN = 3.3 V, all except nSLEEP 16.5 33
tDEG Input deglitch time 312 468 ns
nFAULT OUTPUT (OPEN-DRAIN OUTPUT)
VOL Output low voltage IO = 5 mA 0.5 V
IOH Output high leakage current VO = 3.3 V 1 μA
H-BRIDGE FETs
RDS(ON) HS FET ON-resistance VM = 5 V, IO = 500 mA, TJ = 25°C 160 250 mΩ
VM = 5 V, IO = 500 mA, TJ = 85°C 190
VM = 2.7 V, IO = 500 mA, TJ = 25°C 200 295
VM = 2.7 V, IO = 500 mA, TJ = 85°C 240
LS FET ON-resistance VM = 5 V, IO = 500 mA, TJ = 25°C 145 240
VM = 5 V, IO = 500 mA, TJ = 85°C 180
VM = 2.7 V, IO = 500 mA, TJ = 25°C 190 285
VM = 2.7 V, IO = 500 mA, TJ = 85°C 235
IOFF Off-state leakage current –2 2 μA
MOTOR DRIVER
fPWM Current control PWM frequency Internal PWM frequency 42.5 kHz
tBLANK Current sense blanking time VREF > 375 mV or DAC codes > 29% 2.4 µs
VREF < 375 mV or DAC codes < 29% 1.6
tR Rise time VM = 5 V, 16 Ω to GND, 10% to 90% VM 120 ns
tF Fall time VM = 5 V, 16 Ω to GND, 10% to 90% VM 100 ns
PROTECTION CIRCUITS
IOCP Overcurrent protection trip level 2 A
tOCP Overcurrent protection period VREF > 375 mV or DAC codes > 29% 1.6 µs
VREF < 375 mV or DAC codes < 29% 1.1
tTSD Thermal shutdown temperature Die temperature 150 160 180 °C
CURRENT CONTROL
IREF VREF input current VREF = 3.3 V –1 1 µA
VTRIP xISEN trip voltage For 100% current step xVREF/5 V
AISENSE Current sense amplifier gain Reference only 5 V/V

7.6 Timing Requirements

TA = 25°C, over operating free-air temperature range (unless otherwise noted)
NO. PARAMETER CONDITIONS MIN TYP MAX UNIT
1 fSTEP Step frequency 250 kHz
2 tWH(STEP) Pulse duration, STEP high 1.9 µs
3 tWL(STEP) Pulse duration, STEP low 1.9 µs
4 tSU(STEP) Setup time, command to STEP rising 200 ns
5 tH(STEP) Hold time, command to STEP rising 1 µs
6 tWAKE Wake-up time, nSLEEP inactive to STEP 1 ms
DRV8834 timing_lvsb19.gifFigure 1. Timing Diagram

7.7 Typical Characteristics

DRV8834 C001_SLVSB19.png
Figure 2. Operating Current
DRV8834 C003_SLVSB19.png
Figure 4. RDS(ON)
DRV8834 C002_SLVSB19.png
Figure 3. Sleep Current
DRV8834 C004_SLVSB19.png
Figure 5. RDS(ON)
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |