SLVSB18H March   2012  – August 2016 DRV8835

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Protection Circuits
        1. 7.3.1.1 Overcurrent Protection (OCP)
        2. 7.3.1.2 Thermal Shutdown (TSD)
        3. 7.3.1.3 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Bridge Control
      2. 7.4.2 Sleep Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Motor Voltage
        2. 8.2.2.2 Lower-Power Operation
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
    2. 9.2 Power Supplies and Input Pins
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Power Dissipation
      2. 10.3.2 Heatsinking
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from G Revision (May 2016) to H Revision

  • Changed the value of the capacitor on the VM pin from 10 µF to 0.1 µF in the Parallel Mode Connections figureGo
  • Added one capacitor to the VM pin and updated the value of the existing capacitor on the VM pin in the Layout ExampleGo
  • Deleted references to TI's PowerPAD package and updated it with thermal pad where applicableGo
  • Added the Receiving Notification of Documentation Updates section Go

Changes from F Revision (April 2016) to G Revision

  • Changed the Layout Guidelines to clarify the guidelines for the VM pin Go

Changes from E Revision (December 2015) to F Revision

  • Deleted nFAULT from the Simplified Schematic in the Description section Go

Changes from D Revision (January 2014) to E Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

Changes from C Revision (September 2013) to D Revision

  • Changed Features bulletGo
  • Changed motor supply voltage range in Description sectionGo
  • Changed Motor power supply voltage range in Recommended Operating ConditionsGo
  • Added tOCR and tDEAD parameters to Electrical CharacteristicsGo
  • Added paragraph to Power Supplies and Input Pins sectionGo
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