ZHCSBM8C September   2013  – October 2014 DRV8860

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 简化电路原理图
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Recommended Output Current
      2. 8.3.2 Daisy Chain Connection
      3. 8.3.3 Protection Circuits
        1. 8.3.3.1 Overcurrent Protection (OCP)
        2. 8.3.3.2 Open Load Detection (OL)
        3. 8.3.3.3 Thermal Shutdown (TSD)
        4. 8.3.3.4 Undervoltage Lockout (UVLO)
        5. 8.3.3.5 Digital Noise Filter
    4. 8.4 Device Functional Modes
      1. 8.4.1 Internal Registers
    5. 8.5 Programming
      1. 8.5.1 Serial Control Interface
        1. 8.5.1.1 Data Writing Waveform
        2. 8.5.1.2 Fault Register Reading Waveform
        3. 8.5.1.3 Special Command
          1. 8.5.1.3.1 Special command: Write Control Register
          2. 8.5.1.3.2 Special command: Read Control Register
          3. 8.5.1.3.3 Special command: Read Data Register
          4. 8.5.1.3.4 Special command: Fault Register Reset
          5. 8.5.1.3.5 Special command: PWM Start
        4. 8.5.1.4 Output Energizing and PWM Control
          1. 8.5.1.4.1 PWM Start Special Command Used
    6. 8.6 Register Maps
      1. 8.6.1 Data Register
      2. 8.6.2 Fault Register
      3. 8.6.3 Control Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Drive Current
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply and Logic Sequencing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Consideration
      1. 11.3.1 Power Dissipation
      2. 11.3.2 Heatsinking
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 修订历史记录

Changes from B Revision (July 2014) to C Revision

Changes from A Revision (November 2013) to B Revision

  • 已增加特性：串行接口Go
  • 已更改“持续电流驱动能力”特性列表Go
  • 删除了特性：可编程电流系统配置Go
  • 更新了应用范围列表 Go
  • 句子“利用这些功能可实现比传统的始终开启解决方案更低的温度运行” 更改为“利用这些功能，可实现比传统的始终开启解决方案更低的运行温度”Go
  • Added the Handling Ratings tableGo
  • Changed the MIN value for VM in the Recommended Operating Conditions table From: 8.2 V To: 8 VGo
  • Added HTTSSOP (PWP) to the Thermal Information tableGo
  • Changed VIL From: MIN = - To: 0 V, TYP = 0.6 V To: - Go
  • Changed VIH From: MIN = 2 V To: 1.5 V, MAX = - To: 5.3 V Go
  • Changed VHYS From: MIN = - To: 100 mV, TYP = 0.45 V To: - Go
  • Added the Timing Requirements tableGo
  • Added the Overview section Go
  • Changed the description of the Recommended Output Current sectionGo
  • Deleted the Example Output Configuration section.Go
  • Changed the Serial Control Interface description text Go

Changes from * Revision (September 2013) to A Revision

  • 增加了特性：可编程电流系统配置Go
  • Changed the MIN value for VM in the Recommended Operating Conditions table From: 8 V To: 8.2 VGo
  • Added the Example Output Configuration section.Go
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