ZHCSIO5B
October 2017 – January 2021
DRV8873-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
SPI Timing Requirements
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Bridge Control
7.3.1.1
Control Modes
7.3.1.2
Half-Bridge Operation
7.3.1.3
22
7.3.1.4
Internal Current Sense and Current Regulation
7.3.1.5
Slew-Rate Control
7.3.1.6
Dead Time
7.3.1.7
Propagation Delay
7.3.1.8
nFAULT Pin
7.3.1.9
nSLEEP as SDO Reference
7.3.2
Motor Driver Protection Circuits
7.3.2.1
VM Undervoltage Lockout (UVLO)
7.3.2.2
VCP Undervoltage Lockout (CPUV)
7.3.2.3
Overcurrent Protection (OCP)
7.3.2.3.1
Latched Shutdown (OCP_MODE = 00b)
7.3.2.3.2
Automatic Retry (OCP_MODE = 01b)
7.3.2.3.3
Report Only (OCP_MODE = 10b)
7.3.2.3.4
Disabled (OCP_MODE = 11b)
7.3.2.4
Open-Load Detection (OLD)
7.3.2.4.1
Open-Load Detection in Passive Mode (OLP)
7.3.2.4.2
Open-Load Detection in Active Mode (OLA)
7.3.2.5
Thermal Shutdown (TSD)
7.3.2.5.1
Latched Shutdown (TSD_MODE = 0b)
7.3.2.5.2
Automatic Recovery (TSD_MODE = 1b)
7.3.2.6
Thermal Warning (OTW)
7.3.3
Hardware Interface
7.3.3.1
MODE (Tri-Level Input)
7.3.3.2
Slew Rate
7.4
Device Functional Modes
7.4.1
Motor Driver Functional Modes
7.4.1.1
Sleep Mode (nSLEEP = 0)
7.4.1.2
Disable Mode (nSLEEP = 1, DISABLE = 1)
7.4.1.3
Operating Mode (nSLEEP = 1, DISABLE = 0)
7.4.1.4
nSLEEP Reset Pulse
7.5
Programming
7.5.1
Serial Peripheral Interface (SPI) Communication
7.5.1.1
SPI Format
7.5.1.2
SPI for a Single Slave Device
7.5.1.3
SPI for Multiple Slave Devices in Parallel Configuration
7.5.1.4
SPI for Multiple Slave Devices in Daisy Chain Configuration
7.6
Register Maps
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.1.1
Motor Voltage
8.2.1.2
Drive Current and Power Dissipation
8.2.1.3
Sense Resistor
8.2.2
Detailed Design Procedure
8.2.2.1
Thermal Considerations
8.2.2.2
Heatsinking
8.2.3
Application Curves
9
Power Supply Recommendations
9.1
Bulk Capacitance Sizing
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
支持资源
11.4
Trademarks
11.5
静电放电警告
11.6
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
PWP|24
MPDS372A
散热焊盘机械数据 (封装 | 引脚)
PWP|24
PPTD264C
订购信息
zhcsio5b_oa
zhcsio5b_pm
11.1
Documentation Support
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP
|
米乐app下载官网(中国)|ios|Android/通用版APP最新版
|
米乐|米乐·M6(中国大陆)官方网站
|
千亿体育登陆地址
|
华体会体育(中国)HTH·官方网站
|
千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载
|
18新利网v1.2.5|中国官方网站
|
bob电竞真人(中国官网)安卓/ios苹果/电脑版【1.97.95版下载】
|
千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装
|