SLVSF66A August   2019  – December  2019 DRV8874

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 External Components
      2. 7.3.2 Control Modes
        1. 7.3.2.1 PH/EN Control Mode (PMODE = Logic Low)
        2. 7.3.2.2 PWM Control Mode (PMODE = Logic High)
        3. 7.3.2.3 Independent Half-Bridge Control Mode (PMODE = Hi-Z)
      3. 7.3.3 Current Sense and Regulation
        1. 7.3.3.1 Current Sensing
        2. 7.3.3.2 Current Regulation
          1. 7.3.3.2.1 Fixed Off-Time Current Chopping
          2. 7.3.3.2.2 Cycle-By-Cycle Current Chopping
      4. 7.3.4 Protection Circuits
        1. 7.3.4.1 VM Supply Undervoltage Lockout (UVLO)
        2. 7.3.4.2 VCP Charge Pump Undervoltage Lockout (CPUV)
        3. 7.3.4.3 OUTx Overcurrent Protection (OCP)
        4. 7.3.4.4 Thermal Shutdown (TSD)
        5. 7.3.4.5 Fault Condition Summary
      5. 7.3.5 Pin Diagrams
        1. 7.3.5.1 Logic-Level Inputs
        2. 7.3.5.2 Tri-Level Inputs
        3. 7.3.5.3 Quad-Level Inputs
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Low-Power Sleep Mode
      3. 7.4.3 Fault Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Primary Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Current Sense and Regulation
          2. 8.2.1.2.2 Power Dissipation and Output Current Capability
          3. 8.2.1.2.3 Thermal Performance
            1. 8.2.1.2.3.1 Steady-State Thermal Performance
            2. 8.2.1.2.3.2 Transient Thermal Performance
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Alternative Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Current Sense and Regulation
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 HTSSOP Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11.1.1 Related Documentation

For related documentation, see the following:
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |