ZHCSD97D January   2012  – January 2015 DS100BR111A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 简化电路原理图
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Electrical Characteristics — Serial Management Bus Interface
    7. 7.7 Timing Requirements — LOS and ENABLE / DISABLE Timing
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Typical 4-Level Input Thresholds
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Control Mode
      2. 8.4.2 SMBus Slave Mode
      3. 8.4.3 SMBus Master Mode
      4. 8.4.4 Signal Conditioning Settings
    5. 8.5 Programming
      1. 8.5.1 System Management Bus (SMBus) and Configuration Registers
      2. 8.5.2 Transfer Of Data Via the SMBus
      3. 8.5.3 SMBus Transactions
      4. 8.5.4 Writing a Register
      5. 8.5.5 Reading a Register
      6. 8.5.6 EEPROM Programming
        1. 8.5.6.1 Master EEPROM Programming
        2. 8.5.6.2 EEPROM Address Mapping
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 OOB (Out-of-Band) Functionality in SAS/SATA Applications
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
        1. 9.2.3.1 Equalization Results (Pre-Channel Only)
        2. 9.2.3.2 Equalization and De-Emphasis Results (Pre-channel and Post-channel, No Tx Source De-emphasis)
        3. 9.2.3.3 Equalization and De-Emphasis Results (Pre-channel and Post-channel, -6 dB Tx Source De-emphasis)
  10. 10Power Supply Recommendations
    1. 10.1 3.3-V or 2.5-V Supply Mode Operation
    2. 10.2 Power Supply Bypass
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档　
    2. 12.2 商标
    3. 12.3 静电放电警告
    4. 12.4 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 修订历史记录

Changes from C Revision (April 2013) to D Revision

  • 已添加、更新或重命名以下部分：器件信息表，应用和实施；电源相关建议；布局；器件和文档支持；机械、封装和订购信息Go
  • Changed ESD Ratings Table Go
  • Added Thermal Information Go
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