ZHCSCR3C October   2012  – August 2014 DS125BR111

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 简化电路原理图
  5. 修订历史记录
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Electrical Characteristics — Serial Management Bus Interface
    7. 7.7 Timing Requirements
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 Functional Datapath Blocks
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Control Mode
      2. 8.4.2 SMBus Mode
      3. 8.4.3 Signal Conditioning Settings
    5. 8.5 Programming
    6. 8.6 Register Maps
      1. 8.6.1 Transfer Of Data Via The SMBus
      2. 8.6.2 SMBus Transactions
      3. 8.6.3 Writing a Register
      4. 8.6.4 Reading a Register
      5. 8.6.5 SMBus Register Information
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Signal Integrity
      2. 9.1.2 RX-Detect in SAS/SATA Applications
      3. 9.1.3 PCIe Applications
        1. 9.1.3.1 RXDET When Using SMBus Modes
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 商标

All other trademarks are the property of their respective owners.

12.2 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损伤。

12.3 术语表

SLYZ022TI 术语表

这份术语表列出并解释术语、首字母缩略词和定义。