ZHCSKE7B February   2017  – October 2019 DS250DF210

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements, Retimer Jitter Specifications
    7. 7.7  Timing Requirements, Retimer Specifications
    8. 7.8  Timing Requirements, Recommended Calibration Clock Specifications
    9. 7.9  Recommended SMBus Switching Characteristics (Slave Mode)
    10. 7.10 Recommended SMBus Switching Characteristics (Master Mode)
    11. 7.11 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Device Data Path Operation
      2. 8.3.2  Signal Detect
      3. 8.3.3  Continuous Time Linear Equalizer (CTLE)
      4. 8.3.4  Variable Gain Amplifier (VGA)
      5. 8.3.5  Cross-Point Switch
      6. 8.3.6  Decision Feedback Equalizer (DFE)
      7. 8.3.7  Clock and Data Recovery (CDR)
      8. 8.3.8  Calibration Clock
      9. 8.3.9  Differential Driver With FIR Filter
        1. 8.3.9.1 Setting the Output VOD, Precursor, and Postcursor Equalization
        2. 8.3.9.2 Output Driver Polarity Inversion
      10. 8.3.10 Debug Features
        1. 8.3.10.1 Pattern Generator
        2. 8.3.10.2 Pattern Checker
        3. 8.3.10.3 Eye Opening Monitor
      11. 8.3.11 Interrupt Signals
    4. 8.4 Device Functional Modes
      1. 8.4.1 Supported Data Rates
      2. 8.4.2 SMBus Master Mode
      3. 8.4.3 Device SMBus Address
    5. 8.5 Programming
      1. 8.5.1 Bit Fields in the Register Set
      2. 8.5.2 Writing to and Reading from the Global/Shared/Channel Registers
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Front-Port Jitter Cleaning Applications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Active Cable Applications
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 Backplane and Mid-Plane Applications
      4. 9.2.4 Design Requirements
      5. 9.2.5 Detailed Design Procedure
      6. 9.2.6 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

ABM Package
101-Pin fcBGA, 0.5mm BGA pitch
Top View
DS250DF210 DS250DF200_pinout.gif

Pin Functions

PIN TYPE INTERNAL
PULLUP/
PULLDOWN		 DESCRIPTION
NAME NO.
HIGH-SPEED DIFFERENTIAL I/Os
RX0N A10 Input None Inverting and noninverting differential inputs to the equalizer. An on-chip 100-Ω termination resistor connects RXP to RXN. These inputs must be AC-coupled.(1)
RX0P A11 Input None
RX1N A7 Input None Inverting and noninverting differential inputs to the equalizer. An on-chip 100-Ω termination resistor connects RXP to RXN. These inputs must be AC-coupled.(1)
RX1P A8 Input None
TX0N L10 Output None Inverting and noninverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs. These outputs must be AC-coupled.(1)
TX0P L11 Output None
TX1N L7 Output None Inverting and noninverting 50-Ω driver outputs. Compatible with AC-coupled differential inputs. These outputs must be AC-coupled.(1)
TX1P L8 Output None
CALIBRATION CLOCK PINS
CAL_CLK_IN F1 Input, 2.5-V CMOS Weak pulldown 25-MHz (±100 PPM) 2.5-V single-ended clock from external oscillator. No stringent phase noise or jitter requirements on this clock. Used to calibrate VCO frequency range.
CAL_CLK_
OUT		 F11 Output, 2.5-V CMOS None 2.5-V buffered replica of calibration clock input (pin E1) for connecting multiple devices in a daisy-chained fashion.
SYSTEM MANAGEMENT BUS (SMBus) PINS
ADDR0 D11 Input, 4-level None 4-level strap pins used to set the SMBus address of the device. The pin state is read on power up. The multi-level nature of these pins allows for 16 unique device addresses. The four strap options include:
0: 1 kΩ to GND
R: 20 kΩ to GND
F: Float
1: 1 kΩ to VDD
Refer to Device SMBus Address for more details.
ADDR1 D1 Input, 4-level None
EN_SMB G1 Input, 4-level None Four-level, 2.5-V input used to select between SMBus master mode (float) and SMBus slave mode (high). The four defined levels are:
0: 1 kΩ to GND - RESERVED
R: 20 kΩ to GND - RESERVED, TI test mode
F: Float - SMBus Master Mode
1: 1 kΩ to VDD - SMBus Slave Mode
SDA G11 I/O, 3.3-V LVCMOS, Open-Drain None SMBus data input / open-drain output. External 2-kΩ to 5-kΩ pullup resistor is required as per SMBus interface standard. This pin is 3.3-V LVCMOS tolerant.
SDC H11 I/O, 3.3-V LVCMOS, Open-Drain None SMBus clock input / open-drain clock output. External 2-kΩ to 5-kΩ pullup resistor is required as per SMBus interface standard. This pin is 3.3-V LVCMOS tolerant.
SMBus MASTER MODE PINS
ALL_DONE_N E1 Output, LVCMOS None Indicates the completion of a valid EEPROM register load operation when in SMBus Master Mode (EN_SMB=Float):
High = External EEPROM load failed or incomplete
Low = External EEPROM load successful and complete
When in SMBus slave mode (EN_SMB=1), this output reflects the status of the READ_EN_N input.
READ_EN_N E11 Input, LVCMOS Weak pullup SMBus Master Mode (EN_SMB=Float): When asserted low, initiates the SMBus master mode EEPROM read function. Once EEPROM read is complete (indicated by assertion of ALL_DONE_N low), this pin can be held low for normal device operation.

SMBus Slave Mode (EN_SMB=1): When asserted low, this causes the device to be held in reset (I2C state machine reset and register reset). This pin must be pulled high or left floating for normal operation in SMBus Slave Mode.
MISCELLANEOUS PINS
INT_N H1 Output, LVCMOS, Open-Drain None Open-drain 3.3-V tolerant active-low interrupt output. It pulls low when an interrupt occurs. The events which trigger an interrupt are programmable through SMBus registers. INT_N can be connected in a wired-OR fashion with other device's interrupt pin. A single pullup resistor in the 2-kΩ to 5-kΩ range is adequate for the entire INT_N net.
NC A1, A2, A4, A5, L1, L2, L4, L5 No connect on board None Unused pins. No connect on the PCB.
TEST0 D10 Input, LVCMOS Weak pullup Reserved TI test pins. During normal (non-test-mode) operation, these pins are configured as inputs and therefore they are not affected by the presence of a signal. These pins may be left floating, tied to GND, or connected to a 2.5-V (maximum) output.
TEST1 D2 Input, LVCMOS Weak pullup
TEST2 E10 Input, LVCMOS Weak pullup
TEST3 E2 Input, LVCMOS Weak pullup
TEST4 H10 Input, LVCMOS Weak pullup
TEST5 H2 Input, LVCMOS Weak pullup
POWER
GND A3, A6, A9, B1, B2, B3, B4, B5, B6, B7, B8, B9, B10, B11, C1, C6, C11, D6, E3, E5, E7, E9, F3, F4, F5, F6, F7, F8, F9, G2, G3, G5, G7, G9, G10, H6, J1, J6, J11, K1, K2, K3, K4, K5, K6, K7, K8, K9, K10, K11, L3, L6, L9 Power None Ground reference. The GND pins on this device must be connected through a low-resistance path to the board GND plane.
VDD C3, C9, D3, D4, D5, D7, D8, D9, H3, H4, H5, H7, H8, H9, J3, J9 Power None Power supply, VDD = 2.5 V ±5%. TI recommends connecting at least six de-coupling capacitors between the DS250DF210’s VDD plane and GND as close to the DS250DF210 as possible. For example, four 0.1-μF capacitors and two 1-μF capacitors directly beneath the device or as close to the VDD pins as possible. The VDD pins on this device must be connected through a low-resistance path to the board VDD plane.
(1) High-speed pins do not have short-circuit protection. High-speed pins must be AC-coupled.
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