ZHCSKE4C october   2016  – december 2020 DS280MB810

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements – Serial Management Bus Interface
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Data Path Operation
      2. 8.3.2 AC-coupled Receiver Inputs
      3. 8.3.3 Signal Detect
      4. 8.3.4 2-Stage CTLE
      5. 8.3.5 Driver DC Gain Control
      6. 8.3.6 2x2 Cross-point Switch
      7. 8.3.7 Configurable SMBus Address
    4. 8.4 Device Functional Modes
      1. 8.4.1 SMBus Slave Mode Configuration
      2. 8.4.2 SMBus Master Mode Configuration (EEPROM Self Load)
    5. 8.5 Programming
      1. 8.5.1 Transfer of Data with the SMBus Interface
    6. 8.6 Register Maps
      1. 8.6.1 Register Types: Global, Shared, and Channel
      2. 8.6.2 Global Registers: Channel Selection and ID Information
      3. 8.6.3 Shared Registers
      4. 8.6.4 Channel Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Backplane and Mid-Plane Reach Extension
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Front-Port Applications
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Pattern Generator Characteristics
        2. 9.2.3.2 Equalizing Moderate Pre-Channel Loss
        3. 9.2.3.3 Equalizing High Pre-Channel Loss
        4. 9.2.3.4 Equalizing High Pre-Channel Loss and Moderate Post-Channel Loss
    3. 9.3 Initialization Set Up
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
      1. 11.2.1 Stripline Example
      2. 11.2.2 Microstrip Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1)CONDITIONS/ASSUMPTIONS(2)DS280MB810UNIT
nFBGA
135 PINS
RθJAJunction-to-ambient thermal resistance4-Layer JEDEC Board45.2°C/W
10-Layer 8-in x 6-in Board26.3
20-Layer 8-in x 6-in Board24.8
30-Layer 8-in x 6-in Board22.7
RθJC(top)Junction-to-case (top) thermal resistance4-Layer JEDEC Board26.6°C/W
RθJBJunction-to-board thermal resistance4-Layer JEDEC Board25.8°C/W
ΨJTJunction-to-top characterization parameter4-Layer JEDEC Board13.3°C/W
10-Layer 8-in x 6-in Board13.0
20-Layer 8-in x 6-in Board13.0
30-Layer 8-in x 6-in Board13.0
ΨJBJunction-to-board characterization parameter4-Layer JEDEC Board22.8°C/W
10-Layer 8-in x 6-in Board21.4
20-Layer 8-in x 6-in Board21.1
30-Layer 8-in x 6-in Board20.8
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) No heat sink or airflow was assumed for these estimations. Depending on the application, a heat sink, faster airflow, or reduced ambient temperature (<85 C) may be required in order to meet the maximum junction temperature specification per the Section 7.3.
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