ZHCSTI6 October   2023 DS320PR410

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 High Speed Electrical Characteristics
    7. 6.7 SMBUS/I2C Timing Charateristics
    8. 6.8 Typical Characteristics
    9. 6.9 Typical Jitter Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Linear Equalization
      2. 7.3.2 Flat-Gain
      3. 7.3.3 Receiver Detect State Machine
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active PCIe Mode
      2. 7.4.2 Active Buffer Mode
      3. 7.4.3 Standby Mode
    5. 7.5 Programming
      1. 7.5.1 Pin mode
        1. 7.5.1.1 Five-Level Control Inputs
      2. 7.5.2 SMBUS/I2C Register Control Interface
        1. 7.5.2.1 Shared Registers
        2. 7.5.2.2 Channel Registers
      3. 7.5.3 SMBus/I 2 C Primary Mode Configuration (EEPROM Self Load)
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 PCIe Reach Extension – x16 Lane Configuration
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Mechanical, Packaging, and Orderable Information

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Design Requirements

As with any high-speed design, there are many factors which influence the overall performance. The following list indicates critical areas for consideration during design.

  • Use 85 Ω impedance traces when interfacing with PCIe CEM connectors. Length matching on the P and N traces should be done on the single-end segments of the differential pair.
  • Use a uniform trace width and trace spacing for differential pairs.
  • Place AC-coupling capacitors near the receiver end of each channel segment to minimize reflections.
  • For PCIe Gen 3.0, 4.0, and 5.0, AC-coupling capacitors of 220 nF are recommended. Set the maximum body size to 0402 and add a cutout void on the GND plane below the landing pad of the capacitor to reduce parasitic capacitance to GND.
  • Back-drill connector vias and signal vias to minimize stub length.
  • Use reference plane vias for a low inductance path for the return current.