ZHCSO34F April 2011 – August 2021 DS80PCI402
PRODUCTION DATA
PIN | I/O, TYPE | DESCRIPTION | |
---|---|---|---|
NAME | NUMBER | ||
DIFFERENTIAL HIGH SPEED I/Os | |||
OUTB_0+, OUTB_0-, OUTB_1+, OUTB_1-, OUTB_2+, OUTB_2-, OUTB_3+, OUTB_3- | 1, 2, 3, 4, 5, 6, 7, 8 | O | Inverting and non-inverting 50-Ω driver bank B outputs with de-emphasis. Compatible with AC-coupled CML inputs. |
INA_0+, INA_0-, INA_1+, INA_1-, INA_2+, INA_2-, INA_3+, INA_3- | 10, 11, 12, 13, 15, 16, 17, 18 | I | Inverting and non-inverting differential inputs to bank A
equalizer. A gated on-chip 50-Ω termination resistor connects INA_n+
to VDD and INA_n- to VDD depending on the state of RXDET. See Table 8-4 AC coupling required on high-speed I/O |
INB_0+, INB_0-, INB_1+, INB_1-, INB_2+, INB_2-, INB_3+, INB_3- | 45, 44, 43, 42, 40, 39, 38, 37 | I | Inverting and non-inverting differential inputs to
bank B equalizer. A gated on-chip 50-Ω termination resistor connects
INB_n+ to VDD and INB_n- to VDD depending on the state of RXDET. See
Table 8-4 AC coupling required on high-speed I/O |
OUTA_0+, OUTA_0-, OUTA_1+, OUTA_1-, OUTA_2+, OUTA_2-, OUTA_3+, OUTA_3- | 35, 34, 33, 32, 31, 30, 29, 28 | O | Inverting and non-inverting 50-Ω driver bank A outputs with de-emphasis. Compatible with AC-coupled CML inputs. |
CONTROL PINS — SHARED (LVCMOS) | |||
ENSMB | 48 | I, 4-LEVEL, LVCMOS | System management bus (SMBus) enable pin Tie 1 kΩ to VDD (2.5-V mode) or VIN (3.3-V mode) = Register access SMBus Reader MODE FLOAT = Read external EEPROM (Controller SMBUS mode) Tie 1 kΩ to GND = Pin mode |
ENSMB = 1 (SMBus Reader MODE) | |||
SCL | 50 | I, 2-LEVEL, LVCMOS, O, open drain | In SMBus Reader MODE, this pin is the SMBus clock
I/O. Clock input or open drain output. External 2-kΩ to 5-kΩ pullup resistor to VDD or VIN recommended as per SMBus interface standards(5) |
SDA | 49 | I, 2-LEVEL, LVCMOS, O, open drain | In both SMBus modes, this pin is the SMBus data
I/O. Data input or open drain output. External 2-kΩ to 5-kΩ pullup resistor to VDD or VIN recommended as per SMBus interface standards(5) |
AD0-AD3 | 54, 53, 47, 46 | I, 4-LEVEL, LVCMOS | SMBus reader Address Inputs. In both SMBus modes,
these pins are the user set SMBus reader address inputs. External 1-kΩ pullup or pulldown recommended. |
READ_EN / SD_TH | 26 | I, FLOAT | In SMBus Reader MODE, this pin is not used. Leave it floating. |
ENSMB = FLOAT (SMBus Controller Mode) | |||
SCL | 50 | I, 2-LEVEL, LVCMOS, O, open drain | Clock output when loading EEPROM configuration, reverting to
SMBus clock input when EEPROM load is complete (
ALL_DONE = 0). External 2-kΩ to 5-kΩ pullup resistor to VDD or VIN recommended as per SMBus interface standards(5) |
SDA | 49 | I, 2-LEVEL, LVCMOS, O, open drain | In both SMBus modes, this pin is the SMBus data I/O. Data input
or open drain output. External 2-kΩ to 5-kΩ pullup resistor to VDD or VIN recommended as per SMBus interface standards(5) |
AD0-AD3 | 54, 53, 47, 46 | I, 4-LEVEL, LVCMOS | SMBus reader Address Inputs. In both SMBus modes, these pins are
the user set SMBus reader address inputs. External 1-kΩ pullup or pulldown recommended. |
READ_EN | 26 | I, 2-LEVEL, LVCMOS | A logic low on this pin starts the load from the external
EEPROM(6) Once EEPROM load is complete ( ALL_DONE = 0), this pin functionality remains as READ_EN. It does not revert to an SD_TH input. |
ALL_DONE | 27 | O, 2-LEVEL, LVCMOS | Valid register load status output HIGH = External EEPROM load failed or incomplete LOW = External EEPROM load passed |
ENSMB = 0 (PIN MODE) | |||
EQA0, EQA1, EQB0, EQB1 |
20, 19, 46, 47 | I, 4-LEVEL, LVCMOS | EQA[1:0] and EQB[1:0] control the level of equalization on the input pins. The pins are active only when ENSMB is deasserted (low). The 8 channels are organized into two banks. Bank A is controlled with the EQA[1:0] pins and bank B is controlled with the EQB[1:0] pins. When ENSMB goes high the SMBus registers provide independent control of each channel. The EQB[1:0] pins are converted to SMBUS AD2/AD3 inputs. See Table 8-2. |
DEMA0, DEMA1, DEMB0, DEMB1 |
49, 50, 53, 54 | I, 4-LEVEL, LVCMOS | DEMA[1:0] and DEMB[1:0] control the level of
de-emphasis of the output driver. The pins are only active when
ENSMB is deasserted (low). The 8 channels are organized into two
banks. Bank A is controlled with the DEMA[1:0] pins and bank B is
controlled with the DEMB[1:0] pins. When ENSMB goes high the SMBus
registers provide independent control of each channel. The DEMA[1:0]
pins are converted to SMBUS SCL/SDA and DEMB[1:0] pins are converted
to AD0, AD1 inputs. See Table 8-3. |
CONTROL PINS — BOTH PIN AND SMBUS MODES (LVCMOS) | |||
RATE | 21 | I, 4-LEVEL, LVCMOS | RATE control pin selects GEN 1,2 and GEN 3
operating modes. Tie 1 kΩ to GND = GEN 1,2 FLOAT = AUTO Rate Select of Gen1/2 and Gen3 with de-emphasis Tie 20 kΩ to GND = GEN 3 without de-emphasis Tied 1 kΩ to VDD = RESERVED |
RXDET | 22 | I, 4-LEVEL, LVCMOS | The RXDET pin controls the receiver detect function. Depending on
the input level, a 50-Ω or > 50-kΩ termination to the power rail
is enabled. See Table 8-4. |
LPBK | 23 | I, 4-LEVEL, LVCMOS | Controls the loopback function Tie 1 kΩ to GND = Root Complex Loopback (INA_n to OUTB_n) Float = Normal Operation Tie 1 kΩ to VDD = End-point Loopback (INB_n to OUTA_n) |
VDD_SEL | 25 | I, LVCMOS | Controls the internal regulator FLOAT = 2.5-V mode Tie GND = 3.3-V mode See Figure 10-1. |
SD_TH | 26 | I, 4-LEVEL, LVCMOS | Controls the internal Signal Detect Threshold. See Table 8-5. |
PRSNT | 52 | I, 2-LEVEL, LVCMOS | Cable Present Detect input. High when a cable is
not present per PCIe Cabling Spec. 1.0. Puts part into low power
mode. When LOW (normal operation) part is enabled. See Table 8-4. |
POWER | |||
VIN | 24 | Power | In 3.3-V mode, feed 3.3 V to VIN In 2.5-V mode, leave floating |
VDD | 9, 14, 36, 41, 51 | Power | Power supply pins 2.5-V mode, connect to 2.5-V supply 3.3-V mode, connect 0.1-µF capacitor to each VDD pin (output of LDO) |
GND | DAP | Power | Ground pad (DAP - die attach pad) |