ZHCSJA9B September   2005  – January 2019 DS90LV028AH

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      连接图
      2.      功能图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Termination
      2. 8.3.2 Threshold
      3. 8.3.3 Fail-Safe Feature
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Receiver Bypass Capacitance
        2. 9.2.2.2 Interconnecting Media
        3. 9.2.2.3 PCB Transmission Lines
        4. 9.2.2.4 Input Fail-Safe Biasing
        5. 9.2.2.5 Probing LVDS Transmission Lines on PCB
        6. 9.2.2.6 Cables and Connectors, General Comments
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Microstrip vs. Stripline Topologies
      2. 11.1.2 Dielectric Type and Board Construction
      3. 11.1.3 Recommended Stack Layout
      4. 11.1.4 Separation Between Traces
      5. 11.1.5 Crosstalk and Ground Bounce Minimization
      6. 11.1.6 Decoupling
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) DS90LV028AH UNIT
D (SOIC)
8 PINS
RθJA Junction-to-ambient thermal resistance 119.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.3 °C/W
RθJB Junction-to-board thermal resistance 62.2 °C/W
ψJT Junction-to-top characterization parameter 10.9 °C/W
ψJB Junction-to-board characterization parameter 61.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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