ZHCSOU1 February 2023 DS90UB638-Q1
PRODUCTION DATA
Each device is programmed with a Unique DIE-ID that is burnt into devices at wafer level; Unique DIE-ID with a 16 bytes customer readable value indicating wafer lot and position of each IC inside a wafer. Combination of Unique DIE-IDs can be read and maintained by customer in a database or in a Hash table. Each system can be identified by the Unique DIE-ID programmed into the devices. Authenticity of the overall system can be established at the powerup/initialization or periodically by checking the Unique DIE-ID.
A Unique DIE-ID is programmed into each device and can be read using I2C reads. To read the Unique DIE-ID, set the IA_SEL (0xB0[5:2]) register to Unique DIE ID Registers (1001), then set register IND_ACC_ADDR (0xB1) address to the Unique ID register being read, and then read the IND_ACC_DATA (0xB2) register to get the Unique DIE-ID. There are 16 Unique ID registers, each of the registers contain 8 bits of the total unique DIE-ID. The table below lists the Unique ID registers addresses.
Unique ID register | IND_ACC_ADDR address |
---|---|
UNIQUE_ID_0 | 0x00 |
UNIQUE_ID_1 | 0x01 |
UNIQUE_ID_2 | 0x02 |
UNIQUE_ID_3 | 0x03 |
UNIQUE_ID_4 | 0x04 |
UNIQUE_ID_5 | 0x05 |
UNIQUE_ID_6 | 0x06 |
UNIQUE_ID_7 | 0x07 |
UNIQUE_ID_8 | 0x08 |
UNIQUE_ID_9 | 0x09 |
UNIQUE_ID_10 | 0x0A |
UNIQUE_ID_11 | 0x0B |
UNIQUE_ID_12 | 0x0C |
UNIQUE_ID_13 | 0x0D |
UNIQUE_ID_14 | 0x0E |
UNIQUE_ID_15 | 0x0F |