ZHCSEW6G may   2013  – november 2020 DS90UB913A-Q1

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5. 4Revision History
  6.   Device Comparison Table
  7. 5Pin Configuration and Functions
    1.     Pin Functions: DS90UB913A-Q1 Serializer
  8. 6Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Recommended Serializer Timing For PCLK
    7. 6.7  AC Timing Specifications (SCL, SDA) - I2C-Compatible
    8. 6.8  Bidirectional Control Bus DC Timing Specifications (SCL, SDA) - I2C-Compatible
    9. 6.9  Timing Diagrams
    10. 6.10 Serializer Switching Characteristics
    11. 6.11 Typical Characteristics
  9. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Frame Format
      2. 7.3.2 Line Rate Calculations for the DS90UB913A/914A
      3. 7.3.3 Error Detection
      4. 7.3.4 Synchronizing Multiple Cameras
      5. 7.3.5 General Purpose I/O (GPIO) Descriptions
      6. 7.3.6 LVCMOS VDDIO Option
      7. 7.3.7 Pixel Clock Edge Select (TRFB / RRFB)
      8. 7.3.8 Power Down
    4. 7.4 Device Functional Modes
      1. 7.4.1 DS90UB913A/914A Operation with External Oscillator as Reference Clock
      2. 7.4.2 DS90UB913A/914A Operation with Pixel Clock from Imager as Reference Clock
      3. 7.4.3 MODE Pin on Serializer
      4. 7.4.4 Internal Oscillator
      5. 7.4.5 Built In Self Test
      6. 7.4.6 BIST Configuration and Status
      7. 7.4.7 Sample BIST Sequence
    5. 7.5 Programming
      1. 7.5.1 Programmable Controller
      2. 7.5.2 Description of Bidirectional Control Bus and I2C Modes
      3. 7.5.3 I2C Pass-Through
      4. 7.5.4 Slave Clock Stretching
      5. 7.5.5 ID[x] Address Decoder on the Serializer
      6. 7.5.6 Multiple Device Addressing
    6. 7.6 Register Maps
  10.   Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Power Over Coax
      2. 8.1.2 Power-Up Requirements and PDB Pin
      3. 8.1.3 AC Coupling
      4. 8.1.4 Transmission Media
    2. 8.2 Typical Applications
      1. 8.2.1 Coax Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 STP Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  11.   Power Supply Recommendations
  12. 8Layout
    1. 8.1 Layout Guidelines
      1. 8.1.1 Interconnect Guidelines
    2. 8.2 Layout Example
  13. 9Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
  14.   Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

6.4 Thermal Information

THERMAL METRIC(1)DS90UB913A-Q1UNIT
RTV (WQFN)
32 PINS
RθJAJunction-to-ambient thermal resistance34.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance8.8°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance3.4°C/W
RθJBJunction-to-board thermal resistance23.4°C/W
ψJTJunction-to-top characterization parameter0.3°C/W
ψJBJunction-to-board characterization parameter8.8°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).
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