ZHCSEN8A NOVEMBER   2014  – January 2016 DS90UH940-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 应用 图
  5. 5 修订历史记录
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings—JEDEC
    3. 7.3  ESD Ratings—IEC and ISO
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  DC Electrical Characteristics
    7. 7.7  AC Electrical Characteristics
    8. 7.8  Timing Requirements for the Serial Control Bus
    9. 7.9  Switching Characteristics
    10. 7.10 Timing Diagrams and Test Circuits
    11. 7.11 Power Sequence
    12. 7.12 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  High Speed Forward Channel Data Transfer
      2. 8.3.2  Low Speed Back Channel Data Transfer
      3. 8.3.3  FPD-Link III Port Register Access
      4. 8.3.4  Clock and Output Status
      5. 8.3.5  LVCMOS VDDIO Option
      6. 8.3.6  Power Down (PDB)
      7. 8.3.7  Interrupt Pin — Functional Description and Usage (INTB_IN)
      8. 8.3.8  General-purpose I/O
        1. 8.3.8.1 GPIO[3:0] and D_GPIO[3:0] Configuration
        2. 8.3.8.2 Back Channel Configuration
        3. 8.3.8.3 GPIO_REG[8:5] Configuration
      9. 8.3.9  SPI Communication
        1. 8.3.9.1 SPI Mode Configuration
        2. 8.3.9.2 Forward Channel SPI Operation
        3. 8.3.9.3 Reverse Channel SPI Operation
      10. 8.3.10 Backward Compatibility
      11. 8.3.11 Input Equalization
      12. 8.3.12 I2S Audio Interface
        1. 8.3.12.1 I2S Transport Modes
        2. 8.3.12.2 I2S Jitter Cleaning
        3. 8.3.12.3 MCLK
      13. 8.3.13 HDCP
        1. 8.3.13.1 HDCP I2S Audio Encryption
      14. 8.3.14 Built-In Self Test (BIST)
        1. 8.3.14.1 BIST Configuration And Status
          1. 8.3.14.1.1 Sample BIST Sequence
        2. 8.3.14.2 Forward Channel and Back Channel Error Checking
      15. 8.3.15 Internal Pattern Generation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Configuration Select
        1. 8.4.1.1 1-lane FPD-Link III Input, 4 MIPI lanes Output
        2. 8.4.1.2 1-lane FPD-Link III Input, 2 MIPI lanes Output
        3. 8.4.1.3 2-lane FPD-Link III Input, 4 MIPI lanes Output
        4. 8.4.1.4 2-lane FPD-Link III Input, 2 MIPI lanes Output
        5. 8.4.1.5 1- or 2-lane FPD-Link III Input, 2 or 4 MIPI lanes Output in Replicate
      2. 8.4.2 MODE_SEL[1:0]
      3. 8.4.3 CSI-2 Interface
      4. 8.4.4 Input Display Timing
      5. 8.4.5 MIPI CSI-2 Output Data Formats
      6. 8.4.6 Non-Continuous / Continuous Clock
      7. 8.4.7 Ultra Low Power State (ULPS)
      8. 8.4.8 CSI-2 Data Identifier
    5. 8.5 Programming
      1. 8.5.1 Serial Control Bus
      2. 8.5.2 Multi-Master Arbitration Support
      3. 8.5.3 I2C Restrictions on Multi-Master Operation
      4. 8.5.4 Multi-Master Access to Device Registers for Newer FPD-Link III Devices
      5. 8.5.5 Multi-Master Access to Device Registers for Older FPD-Link III Devices
      6. 8.5.6 Restrictions on Control Channel Direction for Multi-Master Operation
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 PCB Layout and Power System Considerations
        2. 9.2.2.2 CML Interconnect Guidelines
      3. 9.2.3 Application Performance Plots
  10. 10Power Supply Recommendations
    1. 10.1 Power Up Requirements and PDB Pin
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档　
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configurations and Functions

NKD
64-Pin WQFN
Top View
DS90UH940-Q1 po_940_snls473.gif

Pin Functions

PIN I/O, TYPE DESCRIPTION
NAME NUMBER
MIPI DPHY / CSI-2 OUTPUT PINS - Layout note: for unused CSI outputs, float those pins (do not connect to an external pullup or pulldown)
CSI0_CLK-
CSI0_CLK+		 21
22		 O, DPHY CSI0 Differential clock
CSI0_D0-
CSI0_D0+		 23
24		 O, DPHY CSI0 Differential pair 0
CSI0_D1-
CSI0_D1+		 25
26		 O, DPHY CSI0 Differential pair 1
CSI0_D2-
CSI0_D2+		 27
28		 O, DPHY CSI0 Differential pair 2
CSI0_D3-
CSI0_D3+		 29
30		 O, DPHY CSI0 Differential pair 3
CSI1_CLK-
CSI1_CLK+		 34
35		 O, DPHY CSI1 Differential clock
CSI1_D0-
CSI1_D0+		 36
37		 O, DPHY CSI1 Differential pair 1
CSI1_D1-
CSI1_D1+		 38
39		 O, DPHY CSI1 Differential pair 2
CSI1_D2-
CSI1_D2+		 40
41		 O, DPHY CSI1 Differential pair 3
CSI1_D3-
CSI1_D3+		 42
43		 O, DPHY CSI1 Differential pair 3
FPD-LINK III INTERFACE - Layout note: for unused FPD-LinkIII inputs, float those pins (do not connect to an external pullup or pulldown)
RIN0- 54 I/O, CML FPD-Link III Inverting Input/Output
The output must be AC-coupled with a 33 nF capacitor.
RIN0+ 53 I/O, CML FPD-Link III True Input/Output
The output must be AC-coupled with a 33 nF capacitor.
RIN1- 59 I/O, CML FPD-Link III Inverting Input/Output
The output must be AC-coupled with a 33 nF capacitor.
RIN1+ 58 I/O, CML FPD-Link III True Input/Output
The output must be AC-coupled with a 33 nF capacitor.
CMF 55 I/O, CML Common Mode Filter. Connect 0.1 µF capacitor to GND
I2C PINS
I2C_SDA 46 I/O, Open-Drain I2C Data Input / Output interface
Open drain. Must have an external pull-up resistor to VDDIO DO NOT FLOAT.
Recommended pull-up: 4.7 kΩ.
I2C_SCL 45 I/O, Open-Drain I2C Clock Input / Output Interface
Open drain. Must have an external pull-up resistor to VDDIO DO NOT FLOAT.
Recommended pull-up: 4.7 kΩ.
IDx 47 I,
Analog Configuration Pin		 Analog input. I2C Serial Control Bus Device ID Address. Table 11
SPI PINS (Pin function programmed through register) - Layout note: for unused SPI pins, tie to an external pulldown
MOSI
(D_GPIO0)		 19 Multi-function pin
I/O, LVCMOS
w/ weak internal PD		 Master Out, Slave In.
(Pin is shared with D_GPIO0)
MISO
(D_GPIO1)		 18 Multi-function pin
I/O, LVCMOS
w/ weak internal PD		 Master In, Slave Out.
(Pin is shared with D_GPIO1)
SPLK
(D_GPIO2)		 17 Multi-function pin
I/O, LVCMOS
w/ weak internal PD		 Serial clock.
(Pin is shared with D_GPIO2)
SS
(D_GPIO3)		 16 Multi-function pin
I/O, LVCMOS
w/ weak internal PD		 Slave select.
(Pin is shared with D_GPIO3)
CONTROL PINS
MODE_SEL0 61 I,
Analog Configuration Pin		 Analog input. Mode Select 0. Connect to external pull-up to VDD33 and pull-down to GND to create a voltage divider. See Table 8
MODE_SEL1 50 I,
Analog Configuration Pin		 Analog input. Mode Select 1. Connect to external pull-up to VDD33 and pull-down to GND to create a voltage divider. See Table 9
PDB 48 I, LVCMOS
Configuration Pin w/ weak internal PD		 Power-Down Mode Input Pin
PDB = 1, device is enabled (normal operation)
PDB = 0, device is powered down.
When the device is in the POWER DOWN state, the LVCMOS outputs are in tri-state, the PLL is shutdown and IDD is minimized.
Note: PDB pin requires minimum ramp time of 200us
BISTEN 5 I, LVCMOS
Configuration Pin w/ weak internal PD		 Bist Enable Pin
0: BIST Mode is disabled.
1: BIST Mode is enabled.
See Built-In Self Test (BIST) for more information
BISTC
(INTB_IN)		 4 I, LVCMOS
Configuration Pin w/ weak internal PD		 Bist Clock Select.
0: PCLK
1: 33MHz
(Pin is shared with INTB_IN)
INTB_IN
(BISTC)		 4 I, LVCMOS
w/ weak internal PD		 Interrupt input.
(Pin is shared with BISTC)
BIDIRECTIONAL CONTROL CHANNEL (BCC) GPIO PINS (default pin function) - Layout note: for unused GPIO(s), tie to an external pulldown
GPIO0
(SDOUT)		 7 Multi-function pin
I/O,
LVCMOS		 BCC GPIO0.
default state: logic LOW
(Pin is shared with SDOUT)
GPIO1
(SWC)		 8 Multi-function pin
I/O,
LVCMOS		 BCC GPIO1.
default state: logic LOW
(Pin is shared with SWC)
GPIO2
(I2S_DC)		 10 Multi-function pin
I/O,
LVCMOS		 BCC GPIO2.
default state: logic LOW
(Pin is shared with I2S_DC)
GPIO3
(I2S_DD)		 9 Multi-function pin
I/O,
LVCMOS		 BCC GPIO3.
default state: logic LOW
(Pin is shared with I2S_DD)
HIGH-SPEED GPIO PINS HIGH-SPEED GPIO PINS (default pin function) - Layout note: for unused D_GPIO(s), tie to an external pulldown
D_GPIO0
(MOSI)		 19 I/O, LVCMOS General Purpose I/O in 2-lane FPD-Link III mode
default state: tri-state
(Pin is shared with MOSI)
D_GPIO1
(MISO)		 18 I/O, LVCMOS General Purpose I/O in 2-lane FPD-Link III mode
default state: tri-state
(Pin is shared with MISO)
D_GPIO2
(SPLK)		 17 I/O, LVCMOS General Purpose I/O in 2-lane FPD-Link III mode
default state: tri-state
(Pin is shared with SPLK)
D_GPIO3
(SS)		 16 I/O, LVCMOS General Purpose I/O in 2-lane FPD-Link III mode
default state: tri-state
(Pin is shared with SS)
REGISTER READ/WRITES ONLY GPIO PINS (default pin function) - Layout note: for unused GPIO(s), tie to an external pulldown
GPIO5_REG
(I2S_DB)		 11 Multi-function pin
I/O, LVCMOS		 General Purpose Input/Output 5
I2C register control only.
default state: logic LOW
(Pin is shared with I2S_DB)
GPIO6_REG
(I2S_DA)		 12 Multi-function pin
I/O, LVCMOS		 General Purpose Input/Output 6
I2C register control only.
default state: logic LOW
(Pin is shared with I2S_DA)
GPIO7_REG
(I2S_WC)		 14 Multi-function pin
I/O, LVCMOS		 General Purpose Input/Output 7
I2C register control only.
default state: logic LOW
(Pin is shared with I2S_WC)
GPIO8_REG
(I2S_CLK)		 13 Multi-function pin
I/O, LVCMOS		 General Purpose Input/Output 8
I2C register control only.
default state: logic LOW
(Pin is shared with I2S_CLK)
SLAVE MODE LOCAL I2S CHANNEL PINS (Pin function programmed through register) - Layout note: for unused I2S outputs, tie to an external pulldown
I2S_WC
(GPIO7_REG)		 14 Multi-function pin
O, LVCMOS		 Slave Mode I2S Word Clock Output.
(Pin is shared with GPIO7_REG)
I2S_CLK
(GPIO8_REG)		 13 Multi-function pin
O, LVCMOS		 Slave Mode I2S Clock Output.
(Pin is shared with GPIO8_REG)
I2S_DA
(GPIO6_REG)		 12 Multi-function pin
O, LVCMOS		 Slave Mode I2S Data Output.
(Pin is shared with GPIO6_REG)
I2S_DB
(GPIO5_REG)		 11 Multi-function pin
O, LVCMOS		 Slave Mode I2S Data Output.
(Pin is shared with GPIO5_REG)
I2S_DC
(GPIO2_REG)		 10 Multi-function pin
O, LVCMOS		 Slave Mode I2S Data Output.
(Pin is shared with GPIO2)
I2S_DD
(GPIO3_REG)		 9 Multi-function pin
O, LVCMOS		 Slave Mode I2S Data Output.
(Pin is shared with GPIO3)
MASTER MODE LOCAL I2S CHANNEL PINS (Pin function programmed through register) - Layout note: for unused GPIO(s), tie to an external pulldown
SWC
(GPIO1)		 8 Multi-function pin
O, LVCMOS		 Master Mode I2S Word Clock Output.
(Pin is shared with GPIO1)
SDOUT
(GPIO0)		 7 Multi-function pin
O, LVCMOS		 Master Mode I2S Data Output.
(Pin is shared with GPIO0)
MCLK
(GPIO9)		 15 Multi-function pin
O, LVCMOS		 Master Mode I2S System Clock Output.
(Pin is shared with GPIO9)
STATUS PINS - Layout note: add a test point (TP) on these pins
PASS 7 O, LVCMOS Normal mode status output pin (BISTEN = 0)
PASS = 1: No fault detected on input display timing
PASS = 0: Indicates an error condition or corruption in display timing. Fault condition occurs:
  1. DE length value mismatch measured once in succession
  2. VSync length value mismatch measured twice in succession
BIST mode status output pin (BISTEN = 1)
PASS = 1: No error detected
PASS = 0: Error detected
POWER & GROUND (1)
VDD33_A,
VDD33_B		 56
31		 Power 3.3V (±10%) supply. Power to on-chip regulator. Requires 10 µF, 1 µF, 0.1 µF, and 0.01 µF capacitors to GND
VDDIO 3 Power LVCMOS I/O power supply, 1.8V (±5%) OR 3.3V (±10%). Requires 10 µF, 1 µF, 0.1 µF, and 0.01 µF capacitors to GND
VDD12_CSI0
VDDP12_CSI
VDD12_CSI1
VDDL12_0
VDDL12_1
VDDP12_CH0
VDDR12_CH0
VDDP12_CH1
VDDR12_CH1		 20
32
33
6
44
51
52
60
57		 Power 1.2V (±5%) supplies. Requires 10 µF, 1 µF, 0.1 µF, and 0.01 µF capacitors to GND at each VDD pin.
CAP_PLL0
CAP_PLL1
CAP_I2S		 49
64
2		 CAP Decoupling capacitor connection for on-chip regulator. Each requires a 0.1 µF decoupling capacitor to GND.
VSS DAP Ground DAP is the large metal contact at the bottom side, located at the center of the WQFN package. Connect to the ground plane (GND) with at least 32 vias.
OTHER PINS
CMLOUTP
CMLOUTN		 62
63		 O, CML Monitor point for equalized differential signal.
Layout recommendation:
1) place 0.1 µF series capacitor on CMLOUTP and CMLOUTN
2) place 100ohm termination between 0.1 µF away from CMLOUTP and CMLOUTN pins
3) place test points from 0.1 µF capacitors
(1) The VDD (VDD12, VDD33, and VDDIO) supply ramp should be faster than 1.5ms with a monotonic rise
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