ZHCSIG6A July 2018 – October 2018 DS90UH940N-Q1
PRODUCTION DATA.
THERMAL METRIC(1) | DS90UB940N-Q1 | UNIT | |
---|---|---|---|
NKD (WQFN) | |||
64 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 24.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 6.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 3.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.1 | °C/W |
ψJB | Junction-to-board characterization parameter | 3.6 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.6 | °C/W |