11.1.1 Power Decoupling Recommendations

Bypass capacitors must be used on power pins. Use high frequency ceramic (surface mount is recommended) 0.1-µF and 0.001-µF capacitors in parallel at the power supply pin with the smallest value capacitor closest to the device supply pin. Additional scattered capacitors over the printed-circuit board improves decoupling. Multiple vias must be used to connect the decoupling capacitors to the power planes. A 10-µF (35-V) or greater solid tantalum capacitor must be connected at the power entry point on the printed-circuit board between the supply and ground.