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ZHCSR65A November 2022 – December 2022 ESD1LIN24

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.5 Thermal Information

THERMAL METRIC⁽¹⁾		ESD1LIN24	UNIT
		DYF (SOD-323)
		2 PINS
R_θJA	Junction-to-ambient thermal resistance	705.4	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	315	°C/W
R_θJB	Junction-to-board thermal resistance	561.5	°C/W
Ψ_JT	Junction-to-top characterization parameter	145	°C/W
Ψ_JB	Junction-to-board characterization parameter	550.2	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.