ZHCSM68C April   2022  – November 2022 ESD2CAN24-Q1 , ESD2CANFD24-Q1 , ESD2CANXL24-Q1

PRODMIX  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—AEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 ESD Ratings - ISO Specification
    5. 6.5 Recommended Operating Conditions
    6. 6.6 Thermal Information
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics – ESD2CAN24-Q1
    9. 6.9 Typical Characteristics – ESD2CANFD24-Q1
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 AEC-Q101 Qualified and Temperature Range
      2. 7.3.2 ISO 10605 ESD Protection
      3. 7.3.3 IEC 61000-4-5 Surge Protection
      4. 7.3.4 IO Capacitance
      5. 7.3.5 Dynamic Resistance
      6. 7.3.6 DC Breakdown Voltage
      7. 7.3.7 Ultra Low Leakage Current
      8. 7.3.8 Clamping Voltage
      9. 7.3.9 Industry Standard Leaded Packages
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.6 Thermal Information

THERMAL METRIC(1) ESD2CAN24-Q1 ESD2CANFD24-Q1 ESD2CANXL24-Q1 UNIT
DBZ (SOT-23) DCK (SOT-323 / SC-70) DBZ (SOT-23) DBZ (SOT-23)
3 PINS 3 PINS 3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 291.5 283.0 316.3 325.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 147.1 164.1 170.7 178.8 °C/W
RθJB Junction-to-board thermal resistance 131.1 105.1 156.2 165.5 °C/W
ΨJT Junction-to-top characterization parameter 32.0 67.1 45.9 52.4 °C/W
ΨJB Junction-to-board characterization parameter 130.2 104.4 155.1 164.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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