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ZHCSIK7B July 2018 – October 2023 ESD321

PRODUCTION DATA

6.5 Thermal Information

THERMAL METRIC ⁽¹⁾		ESD321		UNIT
		DYA (SOD-523)	DPY (X1SON)
		2 Pins	2 Pins
R_θJA	Junction-to-ambient thermal resistance	774.7	437.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	462.3	249.5	°C/W
R_θJB	Junction-to-board thermal resistance	541.1	169.2	°C/W
Ψ_JT	Junction-to-top characterization parameter	164.4	99.3	°C/W
Ψ_JB	Junction-to-board characterization parameter	534.6	168.6	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.