米6体育平台手机版

ZHCSIK8 July 2018 ESD351

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		ESD351	UNIT
		DPY (X1SON)
		2 PINS
R_θJA	Junction-to-ambient thermal resistance	409.4	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	216.8	°C/W
R_θJB	Junction-to-board thermal resistance	140.4	°C/W
Ψ_JT	Junction-to-top characterization parameter	81.4	°C/W
Ψ_JB	Junction-to-board characterization parameter	140.0	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.