米6体育平台手机版

ZHCSIK8 July 2018 ESD351

PRODUCTION DATA.

At TA = 25°C unless otherwise noted

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
V_RWM	Reverse stand-off voltage	I_IO < 50 nA, across operating temperature range			3.6	V
I_LEAKAGE	Leakage current at 3.6 V	V_IO = 3.6 V, I/O to GND		0.1	10	nA
V_BRF	Breakdown voltage, I/O to GND ⁽¹⁾	I_IO = 1 mA	4.5		7.5	V
V_FWD	Forward Voltage, GND to I/O ⁽¹⁾	I_IO = 1 mA		0.8		V
V_HOLD	Holding voltage, I/O to GND ⁽²⁾	I_IO = 1 mA		5.1		V
V_CLAMP	Clamping voltage	I_PP = 6 A (8/20 µs Surge), I/O to GND		6.1		V
		I_PP = 16 A (100 ns TLP), I/O to GND		6.5		V
		I_PP = 16 A (100 ns TLP), GND to I/O		2.5		V
R_DYN	Dynamic resistance	I/O to GND, 100 ns TLP, between 10 to 20 A I_PP		0.1		Ω
R_DYN	Dynamic resistance	GND to I/O , 100 ns TLP, between 10 to 20 A I_PP		0.08		Ω
C_LINE	Line capacitance, IO to GND	V_IO= 0 V, V_p-p= 30 mV, f = 1 MHz		1.8	2.2	pF

(1) V_BRF and V_BRR are defined as the voltage obtained at 1 mA when sweeping the voltage up, before the device latches into the snapback state

(2) V_HOLD is defined as the voltage when 1 mA is applied, after the device has successfully latched into the snapback state.