ZHCSRZ1A april   2023  – june 2023 ESD441

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5. 4Revision History
  6. 5Pin Configuration and Functions
  7. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—JEDEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7Application and Implementation
    1. 7.1 Application Information
  9. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DPL|2
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information

THERMAL METRIC (1) ESD441 UNIT
DPL (X2SON)
2 PINS
RθJA Junction-to-ambient thermal resistance 519.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 336.9 °C/W
RθJB Junction-to-board thermal resistance 209.2 °C/W
ΨJT Junction-to-top characterization parameter 136.7 °C/W
ΨJB Junction-to-board characterization parameter 207.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance NA °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.