ZHCSUW1 February 2024 ESD652-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | ESD652(Q1) | UNIT | |
|---|---|---|---|
| DBZ (SOT-23) | |||
| 3 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 249.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 129.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 83.1 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 24.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 82.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | NA | °C/W |