The optimum placement of the device is as close
to the connector as possible.
EMI during an ESD event can couple from the trace
being struck to other nearby unprotected traces,
resulting in early system failures.
The PCB designer must minimize the possibility of
EMI coupling by keeping any unprotected traces
away from the protected traces which are between
the TVS and the connector.
Route the protected traces as straight as possible.
Eliminate any sharp corners on the protected traces between the TVS and the
connector by using rounded corners with the largest radii possible.
Electric fields tend to build up on corners, increasing EMI
coupling.
If pin 3 is connected to ground, use a thick and
short trace for this return path.