米6体育平台手机版

ZHCSIS5B May 2018 – January 2024 ESDS302 , ESDS304

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.5 Thermal Information

THERMAL METRIC⁽¹⁾		ESDS302	ESDS304	UNIT
		DBV (SOT-23)	DBV (SOT-23)
		5 PINS	5 PINS
R_θJA	Junction-to-ambient thermal resistance	176.2	133.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	125.7	85.1	°C/W
R_θJB	Junction-to-board thermal resistance	88.4	49.4	°C/W
Ψ_JT	Junction-to-top characterization parameter	71.4	30.1	°C/W
Ψ_JB	Junction-to-board characterization parameter	88.2	49.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.