米6体育平台手机版

ZHCSIH2C May 2018 – February 2024 ESDS311 , ESDS312 , ESDS314

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.5 Thermal Information

THERMAL METRIC ⁽¹⁾		ESDS311	ESDS312	ESDS314	UNIT
		DYF (SOD323)	DBV (SOT-23)	DBV (SOT-23)
		2 PINS	5 PINS	5 PINS
R_θJA	Junction-to-ambient thermal resistance	739.2	163.9	127.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	287.7	113.4	78.9	°C/W
R_θJB	Junction-to-board thermal resistance	605.5	76.9	43.9	°C/W
Ψ_JT	Junction-to-top characterization parameter	118.4	59.8	24.5	°C/W
Ψ_JB	Junction-to-board characterization parameter	591.1	76.8	43.7	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.