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ZHCSU26A December 2023 – February 2024 ESDS552

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.5 Thermal Information

THERMAL METRIC⁽¹⁾		ESDS552	UNIT
		DBZ (SOT-23)
		3 PINS
R_θJA	Junction-to-ambient thermal resistance	244.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	107.4	°C/W
R_θJB	Junction-to-board thermal resistance	85.5	°C/W
Ψ_JT	Junction-to-top characterization parameter	12.8	°C/W
Ψ_JB	Junction-to-board characterization parameter	84.8	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.