ZHCSCQ6C August   2014  – October 2024 FDC1004

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Voltage Level
    7. 5.7 I2C Interface Timing
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 The Shield
      2. 6.3.2 The CAPDAC
      3. 6.3.3 Capacitive System Offset Calibration
      4. 6.3.4 Capacitive Gain Calibration
    4. 6.4 Device Functional Modes
      1. 6.4.1 Single Ended Measurement
      2. 6.4.2 Differential Measurement
    5. 6.5 Programming
      1. 6.5.1 Serial Bus Address
      2. 6.5.2 Read/Write Operations
      3. 6.5.3 Device Usage
        1. 6.5.3.1 Measurement Configuration
        2. 6.5.3.2 Triggering Measurements
        3. 6.5.3.3 Wait for Measurement Completion
        4. 6.5.3.4 Read of Measurement Result
    6. 6.6 Register Maps
      1. 6.6.1 Registers
        1. 6.6.1.1 Capacitive Measurement Registers
        2. 6.6.1.2 Measurement Configuration Registers
        3. 6.6.1.3 FDC Configuration Register
        4. 6.6.1.4 Offset Calibration Registers
        5. 6.6.1.5 Gain Calibration Registers
        6. 6.6.1.6 Manufacturer ID Register
        7. 6.6.1.7 Device ID Register
  8. Applications and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Liquid Level Sensor
      2. 7.1.2 46
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Best Design Practices
    4. 7.4 Initialization Set Up
    5. 7.5 Power Supply Recommendations
    6. 7.6 Layout
      1. 7.6.1 Layout Guidelines
      2. 7.6.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision B (April 2015) to Revision C (October 2024)

  • 将数据表标题从“FDC1004 适用于电容式感应解决方案的 4 通道电容数字转换器”更改为“FDC1004 适用于电容式感应应用的 4 通道电容数字转换器”Go
  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 将提到 I2C 的旧术语实例通篇更改为控制器和目标Go
  • 器件信息 表更改为封装信息 Go
  • Changed Equation 1 Go

Changes from Revision A (October 2014) to Revision B (April 2015)

  • 通篇将最大温度范围从 85°C 更改为 125°CGo
  • 添加了 VSSOP 封装类型Go
  • Deleted WSON DAP explicit assignment to GND in diagramGo
  • Added VSSOP package diagram Go
  • Changed table from Handling Ratings to ESD Ratings and moved Storage Temp to Absolute Maximum Ratings Go
  • Added JA thermal resistance for VSSOP package Go
  • Added JC thermal resistance for WSON package Go
  • Added JC thermal resistance for VSSOP package Go
  • Added JC thermal resistance for WSON package Go
  • Added JB thermal resistance for VSSOP package Go
  • Added note to Electrical Characteristics limits Go
  • Changed TcCOFF to "46" from "30"Go
  • Changed GERR to "0.2" from "0.07" Go
  • Changed gain error unit to "%" from "% of full scale"Go
  • Changed tcG to "-37.5" from "2.1" Go
  • Changed tcG unit to "ppm/°C" from "ppm of full scale/°C"Go
  • Added testing for PSRR conditionGo
  • Changed PSRR to "13.6" from "11" Go
  • Changed FRCAPDACto "96.9" from "96.875" Go
  • Deleted CAPDAC resolution from EC tableGo
  • Changed TcCOFFCAPDAC to "30" from "1" Go
  • Changed TcCOFFCAPDACto "fF" from "ppm of FS/°C" Go
  • Changed DRV value of 400pF from typ and moved to max limitGo
  • Added note to Electrical Characteristics table Go
  • Changed plot for Active Supply Current vs Temperature due to change in temperature range Go
  • Changed plot for Stand-by Supply Current vs Temperature due to change in temperature range Go
  • Changed plot for Gain Drift vs Temperature due to change in temperature range and gain drift unit Go
  • Changed plot for Offset Drift vs Temperature due to change in temperature range Go
  • Added capacitance vs voltage plot Go
  • Changed shield configuration example for differential mode from "CIN2-CIN1, where CHA=CIN2 and CHB=CIN1" to "CIN1-CIN2, where CHA=CIN1 and CHB=CIN2" Go
  • Changed shield configuration example for differential mode from "CIN2-CIN1, where CHA=CIN2 and CHB=CIN1" to "CIN1-CIN2, where CHA=CIN1 and CHB=CIN2" Go
  • Changed plot for Active Supply Current vs Temperature due to change in temperature range Go

Changes from Revision * (August 2014) to Revision A (October 2014)

  • Added Parameter not tested in production Go
  • Changed CINx to CINn throughout Go
  • Added note for Applications and Implementation section.Go