See (1) | | MIN | MAX | UNIT |
|---|
| Input voltage | VDD | –0.3 | 6 | V |
| SCL, SDA | –0.3 | 6 | V |
| at any other pin | –0.3 | VDD+0.3 | V |
| Input current | at any pin | | 3 | mA |
| Junction temperature(2) | | | 150 | °C |
| Storage temperature | TSTG | –65 | 150 | °C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum power dissipation is a function of TJ(MAX), RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board.