ZHCSCQ6C August   2014  – October 2024 FDC1004

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Voltage Level
    7. 5.7 I2C Interface Timing
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 The Shield
      2. 6.3.2 The CAPDAC
      3. 6.3.3 Capacitive System Offset Calibration
      4. 6.3.4 Capacitive Gain Calibration
    4. 6.4 Device Functional Modes
      1. 6.4.1 Single Ended Measurement
      2. 6.4.2 Differential Measurement
    5. 6.5 Programming
      1. 6.5.1 Serial Bus Address
      2. 6.5.2 Read/Write Operations
      3. 6.5.3 Device Usage
        1. 6.5.3.1 Measurement Configuration
        2. 6.5.3.2 Triggering Measurements
        3. 6.5.3.3 Wait for Measurement Completion
        4. 6.5.3.4 Read of Measurement Result
    6. 6.6 Register Maps
      1. 6.6.1 Registers
        1. 6.6.1.1 Capacitive Measurement Registers
        2. 6.6.1.2 Measurement Configuration Registers
        3. 6.6.1.3 FDC Configuration Register
        4. 6.6.1.4 Offset Calibration Registers
        5. 6.6.1.5 Gain Calibration Registers
        6. 6.6.1.6 Manufacturer ID Register
        7. 6.6.1.7 Device ID Register
  8. Applications and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Liquid Level Sensor
      2. 7.1.2 46
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Best Design Practices
    4. 7.4 Initialization Set Up
    5. 7.5 Power Supply Recommendations
    6. 7.6 Layout
      1. 7.6.1 Layout Guidelines
      2. 7.6.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Capacitive System Offset Calibration

The capacitive offset can be due to many factors including the initial capacitance of the sensor, parasitic capacitances of board traces, and the capacitance of any other connections between the sensor and the FDC.

The parasitic capacitances of the FDC1004 are calibrated out at production. If there are other sources of offset in the system, it can be necessary to calibrate the system capacitance offset in the application. Any offset in the capacitance input larger than ½ LSB of the CAPDAC should first be removed using the on-chip CAPDACs. Any residual offset of approximately 1pF can then be removed by using the capacitance offset calibration register. The offset calibration register is reloaded by the default value at power-on or after reset. Therefore, if the offset calibration is not repeated after each system power-up, the calibration coefficient value should be stored by the host controller and reloaded as part of the FDC1004 setup.